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    Potential of low-temperature post processing of silica gel for high-temperature stable LED encapsulant

    In this study, a low-temperature post processing of silica gel for high-temperature stable LED encapsulant was developed. The results indicated that the silica gels prepared by 1st post heat treatment at 300 °...

    Jau-Sheng Wang, Shun-Yuan Huang in Journal of Sol-Gel Science and Technology (2012)