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7 Result(s)

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  1. No Access

    Article

    A diffraction study of the γ″ phase in INCONEL 718 superalloy

    The crystal structure and morphology of the γ″ phase in INCONEL 718 (IN-718) superalloy was studied by using theoretical prediction, transmission electron microscopy, and computer simulation. The experimental res...

    S. J. Hong, W. P. Chen, T. W. Wang in Metallurgical and Materials Transactions A (2001)

  2. No Access

    Article

    Reactions of lead-free solders with CuNi metallizations

    We have done experimental research on the dissolution rate and intermetallic growth on Cu, Ni, and CuNi-alloy substrates as a function of time and Cu/Ni ratio of the substrate. Reactions that occur when CuNi m...

    T. M. Korhonen, P. Su, S. J. Hong, M. A. Korhonen… in Journal of Electronic Materials (2000)

  3. No Access

    Article

    Development of under bump metallizations for flip chip bonding to organic substrates

    Several under bump metallization (UBM) schemes using CuNi alloys as the solderable layer were investigated. Nickel slows down dissolution of the UBM into the solder and formation of intermetallics during reflo...

    T. M. Korhonen, P. Su, S. J. Hong, M. A. Korhonen… in Journal of Electronic Materials (1999)

  4. No Access

    Article

    Under Bump Metallization Development for Eutectic Pb-Sn Solders

    Due to its advantage in number of I/Os over other interconnection method, flip chip interconnection technology plays a key role in today’s electronics packaging. Good understanding of interfacial reactions bet...

    S. J. Hong, T. M. Korhonen, M. A. Korhonen, C.-Y. Li in MRS Online Proceedings Library (1998)

  5. No Access

    Article

    Flip Chip Metallurgies for Lead-Free Solders

    The most commonly used lead-free solders contain large amounts of tin, which makes them incompatible with the conventional Cu-based underbump metallization (UBM) schemes. The tin in the solder reacts with the ...

    T. M. Korhonen, S. J. Hong, M. A. Korhonen, C.-Y. Li in MRS Online Proceedings Library (1998)

  6. No Access

    Article

    Low Stress under Bump Metallizations for Direct Chip Attach

    In order to use a flip chip method for bonding the Si chip directly to an organic substrate, compatible under bump metallization (UBM) must be available. Conventional schemes with a copper-based solderable lay...

    P. Su, T. M. Korhonen, S. J. Hong, M. A. Korhonen… in MRS Online Proceedings Library (1998)

  7. No Access

    Article

    Under Bump Metallization Development for High Sn Solders

    Several under bump metallisation (UBM) schemes using Ni or CuNi alloys as the solderable layer were investigated. Cr or Ti was used as the adhesion layer. The UBM pads of different compositions were sputter de...

    T. M. Korhonen, S. J. Hong, P. Su, C. Zhou… in MRS Online Proceedings Library (1997)