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    Fracture Behavior of Silicon Cut with a High Power Laser

    The fracture twist test is used to obtain the statistical fracture strength distribution for 10-cm square single crystal and polycrystalline silicon wafers cut with a high-power Nd:YAG laser. Tensile wafer edg...

    C. C. Chao, R. Chleboski, E. J. Henderson, C. K. Holmes… in MRS Online Proceedings Library (1991)