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Article
Indirect evaluation of the long-term oxidation properties of Al−21Ti−23Cr and Al−37Ti−12Cr coating materials for TiAl alloy
The most pertinent coating materials in the Al−Ti−Cr alloy system to improve the high temperature oxidation resistance of a TiAl alloy, with respect to oxidation properties, resistance to thermal stress, and c...
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Article
Effects of the colony size on the fracture toughness of TiAl−Mo−B alloys
The effect of the colony size on the fracture toughness of Ti−46.5Al−1.5Mo−xB (x=0.1, 0.6, 1.0) alloys was investigated. The colony size was varied by a heat treatment in the alpha-single phase region and by d...
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Article
Effects of the variation in α-phase volume fraction on the thermal stability of TiAl alloys with a lamellar microstructure
The thermal stability of two-phase (α + γ) lamellar microstructure in Ti-Al-Mo PST (polysynthetically twinned that has single colony) crystals, containing C or Si, was investigated. In addition, the variation ...
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Article
Phase transformation and microstructural features of NiAl/Ni3Al two-phase alloys containing ternary elements
Various ternary elements were added to observe the effects on the microstructural features of β+γ′ two-phase alloys. The microstructural features of β+γ′ two-phase (Ni66Al34)100-χXχ(X=Ti, Si, Nb) depended on the ...
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Article
Effects of texture on the etching property of Fe-36%Ni invar sheets
In order to make a high quality color cathode ray tube, the influence of the texture on the etching property of an invar (Fe-36%Ni) shadow mask sheet has been studied. For the etching property, new values (gR-, a
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Article
Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon wafer
A silicon-to-In2O3:Sn coated glass bonding has been developed for the package of field emission arrays fabricated on the silicon wafer, utilizing a conventional silicon-to- silicon anodic bonding using the glass ...
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Article
Fabrication of silicon membrane using fusion bonding and two-step electrochemical etch-stop**
A new type of silicon membrane structure was fabricated using wafer fusion bonding and two-step electrochemical etch-stop** methods. An “active wafer” of p-type epi/n-type epi/p-type substrate was first elct...
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Article
Interfacial oxide growth and filling-up behaviour of the micro-gap in silicon fusion bonding processes
In the silicon fusion bonding (SFB) process, the influence of post-annealing atmospheres on the micro-gap existing at the Si-Si bonding interface was investigated with the observation of ultrasonic images, ang...
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Article
Electrical characteristics and reheat-treatment effects in a ZnO varistor fabricated by two-stage heat-treatment
Conventional ZnO varistors are generally fabricated by sintering ZnO powder mixed with additives such as Bi2O3, Sb2O3, Cr2O3, Co2O3, and MnO2. To reduce abnormal grain growth and change in electrical characterist...