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    High temperature lead-free solder for microelectronics

    This paper reports results of a four-year industrial consortium effort to develop lead-free solders for high-temperature applications (up to 160°C). Work included preliminary evaluations of 32 tin-based alloys...

    Frank W. Gayle, Gary Becka, Ahmer Syed, Jerry Badgett, Gordon Whitten, Tsung-Yu Pan in JOM (2001)