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3 Result(s)

within J. -S. Ha Remove this filter Solid State Physics Remove this filter

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  1. No Access

    Article

    The Effects of Si Submounts Containing Cu Thermal Vias on the Heat-Dissipation Characteristics of a High-Power Light-Emitting Diode Package

    We investigated the effects of Si submounts containing Cu thermal vias on the heat-dissipation characteristics of a high-power light-emitting diode (LED) package. Simulations were used to determine the optimum...

    M. Y. Kim, T. Jeong, J. S. Ha, T. S. Oh in Journal of Electronic Materials (2014)

  2. No Access

    Chapter

    GaN and ZnO Light Emitters

    In the recent several decades, there are huge concerns in solid-state light emitters based on semiconductor compound materials, which emit light of ultraviolet to red light. Light-emitting diode (LED) fabricat...

    J. -S. Ha in Oxide and Nitride Semiconductors (2009)

  3. No Access

    Article

    Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization

    This paper reports the formation of intermetallic compounds in Au/Ni/Cu/Ti under-bump-metallization (UBM) structure reacted with Ag-Sn eutectic solder. In this study, UBM is prepared by evaporating Au(500 Å)/N...

    J. Y. Park, C. W. Yang, J. S. Ha, C. -U. Kim, E. J. Kwon… in Journal of Electronic Materials (2001)