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Article
Identification of a novel PML-RARG fusion in acute promyelocytic leukemia
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Article
The Effects of Si Submounts Containing Cu Thermal Vias on the Heat-Dissipation Characteristics of a High-Power Light-Emitting Diode Package
We investigated the effects of Si submounts containing Cu thermal vias on the heat-dissipation characteristics of a high-power light-emitting diode (LED) package. Simulations were used to determine the optimum...
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Article
Effect of Al pre-deposition on AlN buffer layer and GaN film grown on Si (111) substrate by MOCVD
In this study, we investigated the effect of Al pre-deposition time on GaN crystal quality. The GaN layer was grown on a Si (111) substrate by metal organic chemical vapor deposition using an AlN buffer layer....
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Article
Activation of a novel palmitoyltransferase ZDHHC14 in acute biphenotypic leukemia and subsets of acute myeloid leukemia
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Chapter
GaN and ZnO Light Emitters
In the recent several decades, there are huge concerns in solid-state light emitters based on semiconductor compound materials, which emit light of ultraviolet to red light. Light-emitting diode (LED) fabricat...
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Article
The effects of ambient oxygen pressure on the 1.54 μm photoluminescence of Er-doped silicon-rich silicon oxide films grown by laser ablation of a Si+Er target
We fabricated Er-doped silicon-rich silicon oxide (SRSO:Er) films by pulsed laser deposition. A Si+Er target consisting of an Er metallic strip and a silicon disk was adopted with a goal to achieve a convenien...
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Article
Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn–Cu solder and thin film metallization
Interfacial reactions and intermetallic compound formation of the eutectic Sn–0.7Cu and hypereutectic Sn–3Cu on thin film metallization of Al/Ni/Cu, Al/Cu, and Al/Ni were investigated. While the Ni layer of Al...
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Article
Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization
This paper reports the formation of intermetallic compounds in Au/Ni/Cu/Ti under-bump-metallization (UBM) structure reacted with Ag-Sn eutectic solder. In this study, UBM is prepared by evaporating Au(500 Å)/N...
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Article
Interaction of low-energy nitrogen ions with an Si(111)-7×7 surface: STM and LEED investigations
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Article
Effect of BN Coating on the Strength of a Mullite Type Fiber
Nextel 480 is a polycrystalline essentially mullite fiber (70 wt.-% Al2O3+28 wt.-% SiO2+ 2 wt.-% B2O3). Different thicknesses of BN were applied as coatings on this fiber. Optical, scanning electron, and transmis...
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Article
Effect of BN coating on the strength of a mullite type fiber
Nextel 480 is a polycrystalline essentially mullite fiber (70 wt.-% Al2O3+28 wt.-% SiO2+2 wt.-% B2O3). Different thicknesses of BN were applied as coatings on this fiber. Optical, scanning electron, and transmiss...