Skip to main content

28 Result(s)

within I. E. Anderson Remove this filter

previous disabled Page of 2
and

  1. No Access

    Chapter and Conference Paper

    Energy Balance Investigation of Close-Coupled Optimized-Pressure Gas Atomization Pour-Tube Design Geometry to Prevent Melt Freeze-Off

    Metal additive manufacturing (AM) is an evolving technology, and the supply of quality feedstock material needs to follow suit. Closed-coupled optimized-pressure gas  (CCOPGA)  narrow size distribution, sphe...

    F. Hernandez, E. Deaton, T. Prost… in TMS 2021 150th Annual Meeting & Exhibition… (2021)

  2. No Access

    Chapter and Conference Paper

    Numerical Simulation and Validation of Gas and Molten Metal Flows in Close-Coupled Gas Atomization

    Molten metal atomization in close-coupled gas atomization dies can operate between two limiting conditions, jetting and filming, together with several complex mechanisms: liquid-gas drafting, downward/upward s...

    F. Hernandez, T. Riedemann, J. Tiarks… in TMS 2019 148th Annual Meeting & Exhibition… (2019)

  3. Article

    Role of the Applied Magnetic Field on the Microstructural Evolution in Alnico 8 Alloys

    Improving performance of permanent magnet (PM) alloys is a complex optimization of microstructure through control of chemistry and processing. Alnico alloys represent a class of chemically complex alloys whose...

    Lin Zhou, M. K. Miller, H. Dillon… in Metallurgical and Materials Transactions E (2014)

    Download PDF (1814 KB) View Article

  4. No Access

    Article

    Advances in Characterization of Non-Rare-Earth Permanent Magnets: Exploring Commercial Alnico Grades 5–7 and 9

    The magnetic domain structure of commercial alnico grades 5–7 and 9 was investigated using a magneto-optical Kerr effect (MOKE) to gain an understanding of their coercivity mechanisms at the micron to millimet...

    A. Palasyuk, E. Blomberg, R. Prozorov, L. Yue, M. J. Kramer, R. W. Mccallum… in JOM (2013)

  5. No Access

    Article

    Advanced gas atomization processing for Ti and Ti alloy powder manufacturing

    A multi-layer ceramic composite melt pour tube for superheating and pouring of molten Ti-6Al-4V (wt.%) was tested using an existing Ti atomization system. Free fall gas atomization was conducted with the pour ...

    A. J. Heidloff, J. R. Rieken, I. E. Anderson, D. Byrd, J. Sears, M. Glynn… in JOM (2010)

  6. No Access

    Article

    Characterization of Hypereutectic Al-Si Powders Solidified under Far-From Equilibrium Conditions

    The rapid solidification microstructure of gas-atomized Al-Si powders of 15, 18, 25, and 50 wt pct Si were examined using scanning electron microscopy (SEM) and transmission electron microscopy (TEM). In order...

    Y. E. Kalay, L. S. Chumbley, I. E. Anderson… in Metallurgical and Materials Transactions A (2007)

  7. No Access

    Article

    Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

    Addressing the potential for drop impact failure of Pb-free interconnects, the shear ductility after extensive aging of Sn-Ag-Cu (SAC) solders has been improved radically by Co or Fe modifications. Several oth...

    I. E. Anderson, J. L. Harringa in Journal of Electronic Materials (2006)

  8. No Access

    Article

    Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

    The shear strength behavior and microstructural effects after aging for 100 h and 1,000 h at 150°C are reported for near-eutectic Sn-Ag-Cu (SAC) solder joints (joining to Cu) made from Sn-3.5Ag (wt.%) and a se...

    I. E. Anderson, J. L. Harringa in Journal of Electronic Materials (2004)

  9. No Access

    Article

    Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity

    Solder joints were prepared from seven eutectic and near-eutectic Sn-based compositions and characterized for electrical resistivity after 100 h and 1,000 h of isothermal aging at 423 K. The solder joint sampl...

    B. A. Cook, I. E. Anderson, J. L. Harringa, S. K. Kang in Journal of Electronic Materials (2003)

  10. No Access

    Article

    Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-Free solder alloys

    The electrical resistivity of solder joints prepared from Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-X alloys (where X = Co, Fe, or Bi) was characterized by a four-point probe technique and interpreted in terms of microstr...

    B. A. Cook, I. E. Anderson, J. L. Harringa… in Journal of Electronic Materials (2002)

  11. No Access

    Article

    Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

    Slow cooling (1–3°C/sec) of Sn-Ag-Cu and Sn-Ag-Cu-X (X = Fe, Co) solder-joint specimens, made by hand soldering, simulated reflow in a surface-mount assembly to achieve similar as-solidified joint microstructu...

    I. E. Anderson, B. A. Cook, J. Harringa, R. L. Terpstra in Journal of Electronic Materials (2002)

  12. No Access

    Article

    Sn-Ag-Cu solders and solder joints: Alloy development, microstructure, and properties

    Slow cooling of Sn-Ag-Cu and Sn-Ag-Cu-X (X = Fe, Co) solder-joint specimens made by hand soldering simulated reflow in surface-mount assembly to achieve similar as-solidified joint microstructures for realisti...

    I. E. Anderson, B. A. Cook, J. L. Harringa, R. L. Terpstra in JOM (2002)

  13. No Access

    Article

    Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests

    The shear deformation behavior of two lead-free solder compositions, Sn-3.5Ag (wt.%) and Sn-3.6Ag-1.0Cu (wt.%), both on copper substrates, was studied using an asymmetric four point bend technique. Four test j...

    B. A. Cook, I. E. Anderson, J. L. Harringa… in Journal of Electronic Materials (2001)

  14. No Access

    Article

    Application of an asymmetrical four point bend shear test to solder joints

    The asymmetrical four-point bend shear (AFPB) test method was used to measure the shear strength and creep properties through the stress relaxation experiments using three different Pb-free solder joint compos...

    Ö. Unal, I. E. Anderson, J. L. Harringa, R. L. Terpstra… in Journal of Electronic Materials (2001)

  15. No Access

    Article

    Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

    This study included a comparison of the baseline Sn-3.5Ag eutectic to one near-eutectic ternary alloy, Sn-3.6 Ag-1.0Cu and two quaternary alloys, Sn-3.6Ag-1.0Cu-0.15Co and Sn-3.6Ag-1.0 Cu-0.45 Co, to increase ...

    I. E. Anderson, J. C. Foley, B. A. Cook, J. Harringa… in Journal of Electronic Materials (2001)

  16. No Access

    Article

    Gas Atomization Processing of LaNi5−xMm, Modified with Silicon and Tin

    A high pressure gas atomization (HPGA) process has been employed to study microsegregation in LaNi4.75 Sn0.25 and LaNi4.6Si0.4 alloy powders to serve as a basis for further investigations of low cost production o...

    J. Ting, V. K. Pecharsky, I. E. Anderson, C. Witham… in MRS Online Proceedings Library (1998)

  17. No Access

    Article

    Benefits of Rapid Solidification Processing of Modified LaNi5 Alloys by High Pressure Gas Atomization for Battery Applications

    A high pressure gas atomization approach to rapid solidification has been employed to investigate simplified processing of Sn modified LaNi5 powders that can be used for advanced Ni/metal hydride (Ni/MH) batterie...

    I. E. Anderson, V. K. Pecharsky, J. Ting, C. Witham… in MRS Online Proceedings Library (1997)

  18. No Access

    Article

    A numerical investigation of gas flow effects on high-pressure gas atomization due to melt tip geometry variation

    A parametric numerical study is presented on how melt feed tube geometry influences the gas flow field of a high-pressure gas atomizer (HPGA). The axisymmetric, turbulent, compressible Navier-Stokes equations ...

    J. Mi, R. S. Figliola, I. E. Anderson in Metallurgical and Materials Transactions B (1997)

  19. No Access

    Chapter

    Processing and Testing of the Low-Temperature Stage Er6Ni2Sn Cryogenic Regenerator Alloy

    Low temperature heat capacity measurements have shown that Er6Ni2Sn might be a useful low temperature, <20 K, cryocooler regenerator material. Here we report on (1) our efforts to prepare small particles for use ...

    K. A. Gschneidner Jr., V. K. Pecharsky, M. G. Osborne, J. O. Moorman… in Cryocoolers 9 (1997)

  20. No Access

    Article

    Particle size effects on chemistry and structure of Al-Cu-Fe quasicrystalline coatings

    Gas atomized Al63Cu25Fe12 powders of varying size fractions were plasma sprayed onto hot (~600 °C) and cool (~25 °C) substrates using Mach I and subsonic plasma gun configurations. The chemical composition and ph...

    D. J. Sordelet, M. F. Besser, I. E. Anderson in Journal of Thermal Spray Technology (1996)

previous disabled Page of 2