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Characterization and Evaluation of Materials
Condensed Matter Physics
Nanotechnology
Guifeng Zhang
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Article
Application of AlMgGaLi foil for joining copper to SiCp/Al-MMCs for high-temperature and high-power electronics
A novel lead-free foil (AlMgGaLi) with a melting point of 398.3 ~ 414.8 °C was developed for active soldering of copper to aluminum matrix composite. The effect of joining pressure on the microstructure, inter...
