Skip to main content

2 Result(s)

within G. Elger Remove this filter

and

  1. No Access

    Article

    Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering

     A packaging process for flip-chip LEDs (light emitting diodes) is described. The LEDs are picked and placed on a silicon substrate wafer. After reflow the substrates are individualized. AuSn solder is used fo...

    G. Elger, M. Hutter, H. Oppermann, R. Aschenbrenner, H. Reichl… in Microsystem Technologies (2002)

  2. No Access

    Article

    EPR studies of photoinduced electron transfer in triad model compounds of photosynthesis

    Time-resolved EPR spectra are reported for porphyrin-quinone-quinone and porphyrin-porphyrin-quinone triads obtained after photoexcitation in the nematic and soft glass phase of liquid crystals. Spin-polarized...

    H. Kurreck, G. Elger, J. von Gersdorff, A. Wiehe, K. Möbius in Applied Magnetic Resonance (1998)