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  1. No Access

    Article

    A thermodynamic study of voiding phenomena in Cu–Cu thermo-compression wafer bonding

    The influence of wafer bonding and post-bond annealing conditions on the (cavity) void size and distribution was investigated theoretically and verified experimentally. Based on Cu–Cu thermo-compression bondin...

    B. Rebhan, J. Svoboda, M. Panholzer in Microsystem Technologies (2018)

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    Article

    Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation

    Metal wafer bonding is a well-established technology in the semiconductor industry. This technology gains more and more importance due to increasing market demands, particularly for three-dimensional integrate...

    B. Rebhan, S. Tollabimazraehno, G. Hesser, V. Dragoi in Microsystem Technologies (2015)