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Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering
A packaging process for flip-chip LEDs (light emitting diodes) is described. The LEDs are picked and placed on a silicon substrate wafer. After reflow the substrates are individualized. AuSn solder is used fo...
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Article
EPR studies of photoinduced electron transfer in triad model compounds of photosynthesis
Time-resolved EPR spectra are reported for porphyrin-quinone-quinone and porphyrin-porphyrin-quinone triads obtained after photoexcitation in the nematic and soft glass phase of liquid crystals. Spin-polarized...