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  1. Article

    Open Access

    Hybrid silicon evanescent approach to optical interconnects

    We discuss the recently developed hybrid silicon evanescent platform (HSEP), and its application as a promising candidate for optical interconnects in silicon. A number of key discrete components and a wafer-s...

    Di Liang, Alexander W. Fang, Hui-Wen Chen, Matthew N. Sysak… in Applied Physics A (2009)

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  2. Article

    Open Access

    Uniformity study of wafer-scale InP-to-silicon hybrid integration

    In this paper we study the uniformity of up to 150 mm in diameter wafer-scale III–V epitaxial transfer to the Si-on-insulator substrate through the O2 plasma-enhanced low-temperature (300°C) direct wafer bonding....

    Di Liang, David C. Chapman, Youli Li, Douglas C. Oakley… in Applied Physics A (2011)

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  3. No Access

    Article

    Integrated Optoelectronic Devices on Silicon

    Silicon (Si) has been the dominating material platform of microelectronics over half century. Continuous technological advances in circuit design and manufacturing enable complementary metal-oxide semiconducto...

    Di Liang, John E. Bowers in MRS Online Proceedings Library (2012)

  4. No Access

    Article

    Hybrid III-V-on-Silicon Microring Lasers

    Hybrid silicon laser is a promising solution to enable high-performance light source on large-scale, silicon-based photonic integrated circuits (PICs). As a compact laser cavity design, hybrid microring lasers...

    Di Liang, Géza Kurczveil, Marco Fiorentino… in MRS Online Proceedings Library (2013)