SpringerLink
Log in

Recrystallization Behavior in Mixed Solder Joints of BGA Components during Thermal Shock

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

Sn-37Pb and Sn-3.0Ag-0.5Cu solder pastes printed onto a board were attached to ball grid array (BGA) samples using Sn-3.0Ag-0.5Cu solder balls. Before thermal shock, the initial grain orientations on the cross-section were obtained by scanning electron microscopy equipped with an electron backscattered diffraction system. Three mixed solder joints (two from the corner and another from the middle of the BGA component) and three lead-free solder joints (at the same positions) were selected to investigate the recrystallization behavior under thermal shock (TS) cycling conditions. All of the mixed and lead-free solder joints were initially single crystal. The results showed that recrystallization occurred in both the mixed and lead-free solder joints after 200 TS. For the mixed solder joints, more recrystallization was observed and the location of samples had a significant influence on their recrystallization behavior, while location was not as important for the lead-free samples after 200 TS in this study. Both the mixed and lead-free solder joints at the corner of BGA components showed the poorest reliability. According to misorientation distribution maps and subgrain rotation behaviors, the reliability of mixed solder joints was much poorer than that of lead-free solder joints.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. O.Y. Liashenko, S. Lay, and F. Hodaj, Acta Mater. 117, 216 (2016).

    Article  Google Scholar 

  2. S. Mukherjee, B. Zhou, A. Dasgupta, and T.R. Bieler, Int. J. Plast. 78, 1 (2016).

    Article  Google Scholar 

  3. J. Han, S. Tan, and F. Guo, J. Electron. Mater. 45, 6086 (2016).

    Article  Google Scholar 

  4. S. Tan, J. Han, and F. Guo, J. Mater. Sci. Mater. Electron. 27, 9642 (2016).

    Article  Google Scholar 

  5. V.L. Nguyen, C.S. Chung, and H.K. Kim, J. Electron. Mater. 45, 125 (2016).

    Article  Google Scholar 

  6. Y.W. Wang, K.H. Lu, V. Gupta, L. Stiborek, D. Shirley, S.H. Chae, J. Im, and P.S. Ho, J. Mater. Res. 27, 1131 (2012).

    Article  Google Scholar 

  7. A. Haseeb, Y.M. Leong, and M.M. Arafat, Intermetallics 54, 86 (2014).

    Article  Google Scholar 

  8. J.W. Yoon, J.H. Bang, C.W. Lee, and S.B. Jung, J. Alloys Compd. 627, 276 (2015).

    Article  Google Scholar 

  9. J. Hokka, T.T. Mattila, H.B. Xu, and M. Paulasto-Krockel, J. Electron. Mater. 42, 963 (2013).

    Article  Google Scholar 

  10. B.T. Zhou, G. Muralidharan, K. Kurumadalli, C.M. Parish, S. Leslie, and T.R. Bieler, J. Electron. Mater. 43, 57 (2014).

    Article  Google Scholar 

  11. F.G.J. Han and J.P. Liu, J. Alloys Compd. 698, 706 (2017).

    Article  Google Scholar 

  12. X. Xu, G.Q. Chen, and M.S. Cheng, in 2015 16th International Conference on Electronic Packaging Technology (2015).

  13. B.T. Zhou, T.R. Bieler, T.K. Lee, and W.J. Liu, J. Electron. Mater. 42, 319 (2013).

    Article  Google Scholar 

  14. T.R. Bieler, B.T. Zhou, L. Blair, A. Zamiri, P. Darbandi, F. Pourboghrat, T.K. Lee, and K.C. Liu, J. Electron. Mater. 41, 283 (2012).

    Article  Google Scholar 

  15. T.R. Bieler, H. Jiang, L.P. Lehman, T. Kirkpatrick, and E.J. Cotts, in Proceedings of 56th Electronic Components & Technology Conference 2006, IEEE. vol 1 and 2, p. 1462 (2006).

  16. B.T. Zhou, Q. Zhou, T.R. Bieler, and T.K. Lee, J. Electron. Mater. 44, 895 (2015).

    Article  Google Scholar 

  17. D.H. Yang, J. Cai, Q. Wang, J.W. Li, Y. Hu, and L.L. Li, J. Mater. Sci. Mater. Electron. 26, 962 (2015).

    Article  Google Scholar 

  18. J.B. Chen, Y.F. Yin, J.P. Ye, and Y.P. Wu, Solder. Surf. Mt. Technol. 27, 76 (2015).

    Article  Google Scholar 

  19. M. Meilunas and P. Borgesen, J. Electron. Packag. 133, 021001 (2011).

    Article  Google Scholar 

  20. A.R. Zbrzezny, P. Snugovsky, T. Lindsay, and R. Lau, IEEE Trans. Electron. Packag. 29, 211 (2006).

    Article  Google Scholar 

  21. Y. Qi, H.R. Ghorbani, and J.K. Spelt, IEEE Trans. Adv. Packag. 29, 690 (2006).

    Article  Google Scholar 

  22. P. Borgesen and M. Meilunas, IEEE Trans. Compon. Packag. Manuf. 1, 1205 (2011).

    Article  Google Scholar 

  23. L. Zhang, L. Sun, Y.H. Guo, and C.W. He, J. Mater. Sci. Mater. Electron. 25, 1209 (2014).

    Article  Google Scholar 

  24. C. Han and B. Han, J. Mech. Sci. Technol. 28, 879 (2014).

    Article  Google Scholar 

  25. J. Johansson, I. Belov, E. Johnson, and P. Leisner, Eng. Comput. 31, 467 (2014).

    Article  Google Scholar 

  26. M.T. Lyttle and J.A. Wert, J. Mater. Sci. 29, 3342 (1994).

    Article  Google Scholar 

Download references

Acknowledgements

The authors acknowledge support of this work by the National Natural Science Foundation of China (No. 51401006), Bei**g Natural Science Foundation (Nos. 2162005 and 2172009), and Science and Technology Project of Bei**g Municipal Education Commission (No. KM201710005003).

Author information

Authors and Affiliations

  1. College of Materials Science and Engineering, Bei**g University of Technology, Bei**g, 100124, China

    Shihai Tan, **g Han & Fu Guo

Authors
  1. Shihai Tan
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. **g Han
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Fu Guo
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to **g Han.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Tan, S., Han, J. & Guo, F. Recrystallization Behavior in Mixed Solder Joints of BGA Components during Thermal Shock. J. Electron. Mater. 47, 4156–4164 (2018). https://doi.org/10.1007/s11664-018-6124-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-018-6124-x

Keywords

Search

Navigation