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Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

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Abstract

The liquid/solid interfacial reactions of Sn-58Bi (SB) and Sn-9Zn (SZ) lead-free solders with Au/Ni/SUS304 multilayer substrates have been investigated in this study. In the SB/Au/Ni/SUS304 couple, only the Ni3Sn4 phase with needle-like grains was formed at the SB/Au/Ni/SUS304 interface. The Ni5Zn21 phase with a column structure was formed at the SZ/Au/Ni/SUS304 interface. The thickness of both intermetallic compounds (IMCs) increased with increasing reaction temperature and time. Meanwhile, the growth mechanism of these two IMCs is seen to follow a parabolic law and is diffusion controlled.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan, ROC

    Yee-Wen Yen & Da-Wei Liaw

  2. Graduate Institute of Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan, ROC

    Yee-Wen Yen, Kuen-Da Chen & Hao Chen

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  1. Yee-Wen Yen
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  2. Da-Wei Liaw
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  3. Kuen-Da Chen
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Correspondence to Yee-Wen Yen.

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Yen, YW., Liaw, DW., Chen, KD. et al. Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate. J. Electron. Mater. 39, 2412–2417 (2010). https://doi.org/10.1007/s11664-010-1336-8

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