SpringerLink
Log in

Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

This study investigates the effects of various reaction times and Cu contents on the interfacial reactions between Sn-9Zn-xCu alloys and Ni substrates. After aging at 255°C for 1 h to 3 h, the Ni5Zn21 and Cu5Zn8 phases formed at the interface of Sn-9Zn/Ni and Sn-9Zn-1wt.%Cu/Ni couples, respectively. The (Ni,Zn)3Sn4 phase was found in the Sn-9Zn-4wt.%Cu/Ni couple, and the (Cu,Ni)6Sn5 and Cu6Sn5 phases formed, respectively, in the Sn-9Zn-7wt.%Cu/Ni and Sn-9Zn-10wt.%Cu/Ni couples. As the reaction time was increased from 5 h to 24 h, the (Cu5Zn8 + Ni5Zn21) phases replaced the Cu5Zn8 phase to form in the Sn-9Zn-1wt.%Cu/Ni couple; the (Ni,Zn)3Sn4 phase formed in the Sn-9Zn-4wt.%Cu/Ni couple, and (CuZn + Cu6Sn5) formed in the Sn-9Zn-10wt.%Cu alloys. Experimental results indicate that intermetallic compound (IMC) formation in Sn-9Zn-xCu/Ni couples changes dramatically with reaction time and Cu content. The Sn-Zn-Ni, Sn-Cu-Ni, and Sn-Zn-Cu ternary isothermal sections greatly help us to understand the IMC evolutions in the Sn-9Zn-xCu/Ni couples.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. D.Q. Yu, H.P. **e, and L.J. Wang, J. Alloy Compd. 385, 119 (2004).

    Article  CAS  Google Scholar 

  2. W.C. Luo, C.E. Ho, J.Y. Tsai, Y.L. Liu, and C.R. Kao, J.␣Mater. Sci. Eng. A 396, 385 (2005).

    Article  Google Scholar 

  3. C.E. Ho, Y.W. Lin, S.C. Yang, C.R. Kao, and D.S. **ang, J.␣Electron. Mater. 35, 1017 (2006).

    Article  CAS  ADS  Google Scholar 

  4. Y.W. Yen, C.C. Jao, and C. Lee, J. Mater. Res. 21, 2986 (2006).

    Article  CAS  ADS  Google Scholar 

  5. Y.W. Yen and W.K. Liou, J. Mater. Res. 22, 2663 (2007).

    Article  CAS  ADS  Google Scholar 

  6. C.Y. Chou, S.W. Chen, and Y.S. Chang, J. Mater. Res. 21, 1849 (2006).

    Article  CAS  ADS  Google Scholar 

  7. H. Baker, ed., ASM Handbook—Alloy Phase Diagram, Vol. 3 (ASM International, Materials Park, Ohio, 1992), pp. 2.178, 2.182, 2.318, 2.321.

  8. C.C. Jao, Y.W. Yen, C.Y. Lin, and C. Lee, J. Intermetall. 16, 463 (2008).

    Article  CAS  Google Scholar 

  9. B.F. Dyson, T.R. Anthony, and D.J. Turnbull, J. Appl. Phys. 38, 3408 (1967).

    Article  CAS  ADS  Google Scholar 

  10. R. Hultgren, P.D. Desai, D.T. Hawkins, M. Gleiser, and K.K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloys (ASM International, Metals Park, Ohio, 1973), pp. 810–1251.

  11. C.Y. Chou (Ph. D. thesis, National Tsing Hua University, 2006), pp. 117–130.

  12. S.C. Yang, C.E. Ho, C.W. Chang, and C.R. Kao, J. Mater. Res. 21, 2436 (2006).

    Article  CAS  ADS  Google Scholar 

  13. C.Y. Chou and S.W. Chen, Acta Mater. 54, 2393 (2006).

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, Taipei, 10672, Taiwan, R.O.C.

    Wei-kai Liou, Yee-Wen Yen & Chien-Chung Jao

  2. Department of Chemical and Materials Engineering, Ta Hwa Institute of Technology, Hsinchu, 30703, Taiwan, R.O.C.

    Chien-Chung Jao

Authors
  1. Wei-kai Liou
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yee-Wen Yen
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Chien-Chung Jao
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Yee-Wen Yen.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Liou, Wk., Yen, YW. & Jao, CC. Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates. J. Electron. Mater. 38, 2222–2227 (2009). https://doi.org/10.1007/s11664-009-0880-6

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-009-0880-6

Keywords

Search

Navigation