Abstract
The electrical resistivity of solder joints prepared from Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-X alloys (where X = Co, Fe, or Bi) was characterized by a four-point probe technique and interpreted in terms of microstructure and composition. The resistivity is also reported of drawn solid wires of these alloys. The solder-joint samples were prepared by hand soldering to copper substrates and were electrically characterized over a temperature range from 293–423 K, covering the anticipated range of elevated-temperature operation for Pb-free solders. Selected joint specimens were measured before and after a 72-h heat treatment at 423 K. Metallographic inspection of the solder joints was performed to characterize coarsening effects and to determine the degree to which these changes affected electrical conduction.
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Cook, B.A., Anderson, I.E., Harringa, J.L. et al. Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-Free solder alloys. J. Electron. Mater. 31, 1190–1194 (2002). https://doi.org/10.1007/s11664-002-0009-7
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DOI: https://doi.org/10.1007/s11664-002-0009-7