SpringerLink
Log in

The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints

  • Original Research Article
  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

The reliability of SnPbAg solder joints containing gold (Au) under different aging conditions have been investigated. The solder joints were prepared by printing Sn62Pn36Ag2 solder paste on gold-plated copper (Cu) pads and then reflow soldering them. Subsequently, the joints underwent aging at temperatures of 75°C, 100°C, 125°C, and 150°C for durations of 100 h, 250 h, 500 h, and 1000 h, respectively. During the aging process, there was a gradual transition of Au from the AuSn4 phase to the (Cu,Au)6Sn5 phase, resulting in a phenomenon known as the “return of Au”. The intermetallic compound (IMC) layer within the solder joint primarily consisted of the Cu3Sn phase and the (Cu,Au)6Sn5 phase, with the IMC layer progressively thickening as the aging time extended. Through the calculation of the growth rate constant (k) and activation energy (Q) for both the Cu3Sn phase and the (Cu,Au)6Sn5 phase, it was found that the growth rate of the (Cu,Au)6Sn5 phase surpassed that of the Cu3Sn phase. Upon reaching an aging parameter of 150 °C for 1000 h, an essentially continuous Pb-rich layer formed above the IMC layer within the solder joint. Following shear force tests, the solder joint experiences ductile fracture, with the mechanical properties of the joint significantly compromised due to the presence of the Pb-rich layer.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price includes VAT (Germany)

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

References

  1. M. Abtew and G. Selvaduray, Lead-free solders in microelectronics. Mater. Sci. Eng. R-Rep. 27, 95 (2000).

    Article  Google Scholar 

  2. Y.S. Lai, P.F. Yang, and C.L. Yeh, Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectron. Reliab. 46, 645 (2006).

    Article  CAS  Google Scholar 

  3. H.K. Yeo and K.H. Han, Wetting and spreading of molten SnPb solder on a Cu-10%Nb micro-composite. J. Alloys Compd. 477, 278 (2009).

    Article  CAS  Google Scholar 

  4. S. Li, C. Hang, Q. Guan, X. Tang, D. Yu, Y. Ding, and X. Wang, The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration. Mater. Today Commun. 36, 106651 (2023).

    Article  CAS  Google Scholar 

  5. P.T. Vianco, A review of interface microstructures in electronic packaging applications: soldering technology. JOM 71, 158 (2019).

    Article  CAS  Google Scholar 

  6. S. Gao, Z. Chen, A. Hu, M. Li, and K. Qian, Electrodeposited Ni microcones with a thin Au film bonded with Au wire. J. Mater. Process. Technol. 214, 326 (2014).

    Article  CAS  Google Scholar 

  7. Chen, Y.J., Huang, K.Y., Chen, H.T., and Kao, C.R. in 2013 IEEE International Symposium on Advanced Packaging Materials (2013), p. 102

  8. J.A. Davis, M.J. Bozack, and J.L. Evans, Effect of (Au, Ni)Sn4 evolution on Sn-37Pb/ENIG solder joint reliability under isothermal and temperature-cycled conditions. IEEE Trans. Compon. Packaging Technol. 30, 32 (2007).

    Article  CAS  Google Scholar 

  9. C.F. Yang and S.W. Chen, Interfacial reactions in Au/Sn/Cu sandwich specimens. Intermetallics 18, 672 (2010).

    Article  CAS  Google Scholar 

  10. Y. Liu, Y.T. Chen, S. Gu, D.W. Kim, and K.N. Tu, Fracture reliability concern of (Au, Ni)Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing. Scr. Mater. 119, 9 (2016).

    Article  Google Scholar 

  11. R. Wheeling, P. Vianco, S. Williams, L. Jauregui, and D.F.S. Gallis, Impact of gold thickness on interfacial evolution and subsequent embrittlement of tin-lead solder joints. J. Electron. Mater. 51, 7337 (2022).

    Article  CAS  Google Scholar 

  12. W.L. Shih, T.L. Yang, H.Y. Chuang, M.S. Kuo, and C.R. Kao, Inhibition of gold embrittlement in micro-joints for three-dimensional integrated circuits. J. Electron. Mater. 43, 4262 (2014).

    Article  CAS  Google Scholar 

  13. L.Y. Hsiao, G.Y. Jang, K.J. Wang, and J.G. Duh, Inhibiting AuSn4 formation by controlling the interfacial reaction in solder joints. J. Electron. Mater. 36, 1476 (2007).

    Article  CAS  Google Scholar 

  14. D. Susan, P. Vianco, R. Grant, P. Hlava, A. Kilgo, and G. Zender, Microscopy of solder joint failures due to gold intermetallic embrittlement. Microsc. Microanal. 11, 1600 (2005).

    Article  Google Scholar 

  15. Susan, D.F., Vianco, P.T., Rejent, J.A., Martin, J.J. and Hlava, P.F. in 3rd International Brazing and Soldering Conference (2006), p. 26

  16. P.T. Vianco, A.C. Kilgo, B.M. McKenzie, R.L. Grant, and S. Williams, Interface embrittlement between 63Sn-37Pb solder and Au layer—Part 1: physical metallurgy of liquid-state and solid-state reactions. J. Electron. Mater. 51, 6431 (2022).

    Article  CAS  Google Scholar 

  17. R. Tian, C. Hang, Y. Tian, and J. Xu, Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes. J. Mater. Process. Technol. 268, 1 (2019).

    Article  CAS  Google Scholar 

  18. T. Laurila, V. Vuorinen, T. Mattila, and J.K. Kivilahti, Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders. J. Electron. Mater. 34, 103 (2005).

    Article  CAS  Google Scholar 

  19. M. Kerr and N. Chawla, Creep deformation behavior of Sn-3.5Ag solder/Cu couple at small length scales. Acta Mater. 52, 4527 (2004).

    Article  CAS  Google Scholar 

  20. M. He, Z. Chen, and G. Qi, Solid state interfacial reaction of Sn-37Pb and Sn-3.5Ag solders with Ni-P under bump metallization. Acta Mater. 52, 2047 (2004).

    Article  CAS  Google Scholar 

  21. G. Khatibi, A.B. Kotas, and M. Lederer, Effect of aging on mechanical properties of high temperature Pb-rich solder joints. Microelectron. Reliab. 1(85), 1–1 (2018).

    Article  Google Scholar 

  22. P.T. Vianco, Understanding the reliability of solder joints used in advanced structural and electronics applications: part 2—reliability performance. Weld. J. 96, 83s (2017).

    Google Scholar 

Download references

Acknowledgments

The authors would like to take this opportunity to express their sincere appreciation to Chinese Academy of Engineering Physics for its support of this work.

Author information

Authors and Affiliations

  1. Department of Applied Physics, Faculty of Science, Tian** University, Tian**, 300354, China

    Yinghao Bi, Weiqi Guo & ** Wu

  2. China Academy of Engineering Physics, Institute of Electronic Engineering, Mianyang, 621900, China

    Shaobin Wang & Weiwei Zhang

Authors
  1. Yinghao Bi
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Weiqi Guo
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Shaobin Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Weiwei Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. ** Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding authors

Correspondence to Shaobin Wang or ** Wu.

Ethics declarations

Conflict of interest

The authors declare that they have no conflict of interest.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Bi, Y., Guo, W., Wang, S. et al. The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints. J. Electron. Mater. (2024). https://doi.org/10.1007/s11664-024-11264-w

Download citation

  • Received:

  • Accepted:

  • Published:

  • DOI: https://doi.org/10.1007/s11664-024-11264-w

Keywords

Search

Navigation