Abstract
The high level of functional integration and the complex package architecture in advanced 3D packages pose a significant challenge for conventional Fault Isolation (FI) and Failure analysis (FA) methods. High-resolution nondestructive FI and imaging tools, as well as innovative applications of FA techniques are required to tackle the technical and throughput challenges. In this Chapter, the applications of FI and FA techniques such as Time domain reflectrometry (TDR), Electro Optic Terahertz Pulse Reflectometry (EOTPR), Lock-in Thermography (LIT), Scanning Superconducting Quantum Interference Device (SQUID) Microscopy (SSM), Scanning Acoustic microscopy (SAM), 2D X-ray radiography, 3D X-ray Computed Tomography (CT), laser ablation, Plasma Focused Ion Beam (FIB), Broad-beam Argon Ion Milling, Energy-dispersive X-ray spectroscopy (EDX), X-ray Photoelectron Spectroscopy (XPS), Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS), and Electron Backscatter Diffraction (EBSD) to 3D packages are reviewed along with the key FI and FA challenges. 3D package FA Strategies of building up efficient FI-FA flow and in-depth root cause studies to provide solution paths are discussed and demonstrated by case studies.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Similar content being viewed by others
References
Y. Li, Y. Cai, M. Pacheco, R.C. Dias, D. Goyal, In Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), Phoenix, 2012, p. 95
R. Agarwal, W. Zhang, P. Limaye, R. Labie, B. Dimcic, A. Phommahaxay, P. Soussan, In Proceedings of Electronic Components and Technology Conference (ECTC), Las Vegas, 2010, p. 858
Y. Li, P.K.M. Srinath, D. Goyal, J. Electron. Mater. 45(1), 116–124 (2016)
Zhiyong Ma and David G. Seiler, “Metrology and Diagnostic Techniques for Nanoelectronics”, Pan Stanford Publishing, (2016), pp. 1089–1119. (To be published).
Y. Cai, Z. Wang, R.C. Dias, D. Goyal, In Proceedings from the 36th International Symposium for Testing and Failure Analysis (ISTFA), 1 November 2010, ASM International, Materials Park, OH, p. 1309
D. Smolyansky, Printed Circuit Design, 20 (April 2002)
D. Abessolo-Bidzo, P. Poirier, P. Descamps, B. Domenges, In Proceedings from the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2005, p. 318
S.H. Hall, G.W. Hal, J.A. McCall, High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices (Wiley, New York, 2000)
K. Matsumoto, H. Otsuka, O. Horiuchi, Y.G. Han, W. Choi, H. Tomokage, Trans. Jpn. Inst. Electron. Packag. 6(1), 57 (2013)
R. Schlangen, S. Motegi, T. Nagatomo, C. Schmidt, F. Altmann, H. Murakami, S. Hollingshead, J. West, In Proceedings from the 37th International Symposium for Testing and Failure Analysis (ISTFA, ASM International) 2011, p. 68
F. Naumann, F. Altmann, C. Grosse, R. Herold, In Proceedings from the 40th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), 2014, p. 130
M. **e, T. Begala, K. Kijkanjanapaiboon, D. Goyal, Conference Proceedings from the 66th Electronic Components and Technology Conference. (ECTC), 755 (2016).
R. Dias, L. Skoglund, Z. Wang, D. Smith, In Proceedings from the 27th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), Santa Clara, 2001, p. 77
M. **e, Z. Qian, M. Pacheco, Z. Wang, R. Dias, V. Talanov, In Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), Phoenix, 2012, p. 11
J. Gaudestad, D. Nuez, P. Tan, In Proceedings from the 40th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), Houston, 2014, p. 43
A. Orozco, N.E. Gagliolo, C. Rowlett, E. Wong, A. Moghe, J. Gaudestad, V. Talanov, A. Jeffers, K. Torkashvan, F.C. Wellstood, S. Dobritz, M. Boettcher, A.B. Cawthorne, F. Infante, In Proceedings from the 40th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), Houston, 2014, p. 33
W. Lawton, J. Barrett, Microelectron. Reliab. 36, 1803 (1996)
J.E. Semmens, Microelectron. Reliab. 40, 1539 (2000)
D.A. Hutt, D.P. Webb, K.C. Hung, C.W. Tang, P.P. Conway, D.C. Whalley, Y.C. Chan, In Proceedings from the 2000 IEEE/CPMT Int’l Electronics Manufacturing Technology Symposium, Santa Clara, 2000, p. 191
J.E. Semmens, L.W. Kessler, Microelectron. Reliab. 42, 1735 (2002)
B.T. Khuri-Yakub, Ultrasonics 31(5), 361 (1993)
G.A.D. Briggs, O.V. Kolosov, Acoustic Microscopy, 2nd edn. (Oxford University Press, New York, 2009)
T.M. Moore, C.D. Hartfield, AIP Conf. Proc. 449, 598 (1998)
A.J. Komrowski, L.A. Curiel, Q. Nguyen, D.J.D. Sullivan, L. Logan-Willams, In Proceedings from the 30th International Symposium for Testing and Failure Analysis, Worcester, 2004, p.1
L. Angrisani, L. Bechou, D. Dallet, P. Daponte, Y. Ousten, Measurement 31, 77 (2002)
J. Sigmund, M. Kearney, Adv. Packag. July/August (1998).
S. Haque, G. Lu, J. Goings, J. Sigmund, Microelectron. Reliab. 40, 465 (2000)
T.S. Leng, J.C.P. McKeon, H.S. Jang, In Proceedings from the 32th International Symposium for Testing and Failure Analysis, Austin, 2006, p. 480
Y. Li, L. Hu, G. Li, R. Dias, D. Goyal, In Proceedings from the 39th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), San Jose, 2013, pp. 468–470
S. Brand, A. Lapadatu, T. Djuric, P. Czurratis, J. Schischka, M. Petzold. J Micro. Nanolithgr. MEMS MOEMS 13(1), 011207 (2014)
I. De Wolf, A. Khaled, M. Herms, M. Wagner, T. Djuric, P. Czurratis, S. Brand, In Proceedings from the 41st International Symposium for Testing and Failure Analysis (ISTFA, ASM International), Portland, 2015, p. 119
J. Perraud, S. Enouz-Vedrenne, J. Clement, A. Grivon, In Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), Phoenix, 2012, p. 332
M. Feser, J. Gelb, H. Chang, H. Cui, F. Duewer, S.H. Lau, A. Tkachuk, W. Yun, Meas. Sci. Technol. 19, 094001 (2008)
Y. Li, J.S. Moore, B. Pathangey, R.C. Dias, D. Goyal, IEEE Trans. Dev. Mater. Reliab. 12(2), 494 (2012)
Y. Li, R. Panat, B. Li, R. Mulligan, P.K. Muther Srinath, A. Raman, IEEE Trans. Dev. Mater. Reliab. 11(1), 141 (2011)
M. Pacheco, D. Goyal, In Proceedings of Electronic Components and Technology Conference, p. 1263.
Y. Li, M. Pacheco, D. Goyal, J.W. Elmer, H.D. Barth, D. Parkinson, In Conference Proceedings from the 64th Electronic Components and Technology Conference (ECTC), Lake Buena, 2014, p. 1457
J.W. Elmer, Y. Li, H.D. Barth, D.Y. Parkinson, M. Pacheco, D. Goyal, J. Electron. Mater. 3 (12), 4421–4427 (2014)
F. Altmann, J. Beyersdorfer, J. Schischka, M. Krause, G. Franz, L. Kwakman, In Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), Phoenix, 2012, p. 39
L. Kwakman, M. Straw, G. Coustillier, M. Sentis, J. Beyersdorfer, J. Schischka, F. Naumann, F. Altmann, In Proceedings from the 39th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), San Jose, 2013, p. 17
Meyer, G. Grimm, M. Hecker, M. Weisheit, E. Langer, In Proceedings from the 38th International Symposium for Testing and Failure Analysis (ISTFA, ASM International), San Jose, p. 12 (2013)
H. Xu, H. Zhang, M. Xue, In Conference Proceedings from the 15th Electronic Components and Technology Conference (ECTC), p. 403 (2013).
P. Van der Heide, X-ray Photoelectron Spectroscopy: An introduction to Principles and Practices (Wiley, Hoboken, 2011)
P. Van der Heide, Secondary Ion Mass Spectrometry: An Introduction to Principles and Practices (Wiley, New York, 2014)
F. Yang, S. Yiqiang, L.H. Sheng, F. Chao, In Conference Proceedings from the 15th Electronic Packaging Technology Conference (EPTC), Singapore, 2013, p. 37
B. Pathangey, A. Proctor, Z. Wang, Z. Fu, R. Tanikella, IEEE Trans. Dev. Mater. Reliab. 7(1), 11 (2007)
Y. Liu, J. Wang, L. Yin, P. Kondos, C. Parks, P. Borgesen, D.W. Henderson, E.J. Cotts, N. Dimitrov, J. Appl. Electrochem. 38, 1695 (2008)
M.H. Lu, D.Y. Shih, P. Lauro, C. Goldsmith, D.W. Henderson, Appl. Phys. Lett. 92, 211909 (2008)
Y. Wang, P.S. Ho, Appl. Phys. Lett. 103, 121909 (2013)
P. Liu, A. Overson, D. Goyal, In Conference Proceedings from the 65th Electronic Components and Technology Conference (ECTC), San Diego, 2015, p. 99
C. Wu, T. Jiang, J. Im, K.M. Liechti, R. Huang, P.S. Ho, In Proceedings from the 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2014, p. 312
R.R. Tummala, Fundamentals of Microsystems Packaging (McGraw-Hill, New York, 2001), pp. 878–923
S. Atkins, L. Teems, W. Rowe, P. Selby, R. Vaughters, Microelectron. Reliab. 38, 773 (1998)
T. Akutsu, Q. Yu, Y. Nishimura, In Conference Proceedings from the 12th Electronic Packaging Technology Conference (EPTC), Singapore, 2010, p. 550
M.M. Basit, M. Motalab, J.C. Suhling, Z. Hai, J. Evans, M.J. Bozack, P. Lall, In Conference Proceedings from the 65th Electronic Components and Technology Conference (ECTC), San Diego, 2015, p. 106
D. Yang, Z. Cui, In Conference Proceedings from the 2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, 2011, p. 1030
S.H. Kim, J.W. Park, S.J. Hong, J.T. Moon, In Conference Proceedings from the 12th Electronic Packaging Technology Conference (EPTC), 2010, p. 545
K. Lee, S. Barbeau, F. Racicot, D. Powell, C. Arvin, T. Wassick, J. Ross, In Conference Proceedings from the 63rd Electronic Components and Technology Conference (ECTC), 2013, p. 2138
X.L. Zhao, J.M. Chin, R.N. Master, In Conference Proceedings of 12th IPFA, Singapore, 2005, p. 258
Y. Li, L. Xu, P. Liu, B. Pathangey, M. Pacheco, M. Hossain, L. Hu, R. Dias, D. Goyal, In Conference Proceedings from the 65th Electronic Components and Technology Conference (ECTC), San Diego, 2015, p. 432
Acknowledgement
The editors would like to thank Frank Altmann and Sebastian Brand from Fraunhofer-Institute for Microstructure of Materials and Systems IMWS in Germany for their critical review of this Chapter.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2017 Springer International Publishing Switzerland
About this chapter
Cite this chapter
Li, Y., Goyal, D. (2017). Fault Isolation and Failure Analysis of 3D Packaging. In: Li, Y., Goyal, D. (eds) 3D Microelectronic Packaging. Springer Series in Advanced Microelectronics, vol 57. Springer, Cham. https://doi.org/10.1007/978-3-319-44586-1_15
Download citation
DOI: https://doi.org/10.1007/978-3-319-44586-1_15
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-44584-7
Online ISBN: 978-3-319-44586-1
eBook Packages: EngineeringEngineering (R0)