Abstract
Consumer electronic products, particularly mobile devices such as mobile phones, thermal scanners, tablets and laptop computers, contain BGA packages and assemblies. These devices are susceptible to impact loading from unintentional drop** of the device during operation and handling. Such loading transfers the induced mechanical shock to solder joints in the electronic assembly that could initiate damage, leading to premature failure of the solder joints. Consequently, mechanical shock loading is considered in reliability assessment of solder joints. Impact loading is introduced through a board-level drop test of a PCB with a surface mounted electronic assembly containing BGA solder joints.
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Tamin, M.N., Shaffiar, N.M. (2014). Application III: Board-Level Drop Test. In: Solder Joint Reliability Assessment. Advanced Structured Materials, vol 37. Springer, Cham. https://doi.org/10.1007/978-3-319-00092-3_8
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DOI: https://doi.org/10.1007/978-3-319-00092-3_8
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