Abstract
The effect of printed circuit board surface finish on the drop loading reliability of ball grid array (BGA) solder interconnects has been examined. The finishes examined include electroless nickel/electroless palladium/immersion gold (ENEPIG) and immersion silver (ImAg). For the ENEPIG finish, the effect of the Pd plating layer thickness was evaluated by testing two different thicknesses: 0.05 μm and 0.15 μm. BGA components were assembled onto the boards using either eutectic Sn-Pb or Sn-3.0Ag-0.5Cu (SAC305) solder. Prior to testing, the assembled boards were aged at 100°C for 24 h or 500 h. The boards were then subjected to multiple 1500-g drop tests. Failure analysis indicated the primary failure site for the BGAs to be the solder balls at the board-side solder interface. Cratering of the board laminate under the solder-attached pads was also observed. In all cases, isothermal aging reduced the number of drops to failure. The components soldered onto the boards with the 0.15-μm-Pd ENEPIG finish with the SAC305 solder had the highest characteristic life, at 234 drops to failure, compared with the other finish–solder combinations.
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Pearl, A., Osterman, M. & Pecht, M. Evaluation of ENEPIG and Immersion Silver Surface Finishes Under Drop Loading. J. Electron. Mater. 45, 391–402 (2016). https://doi.org/10.1007/s11664-015-4104-y
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DOI: https://doi.org/10.1007/s11664-015-4104-y