Abstract
Crumpling is potentially a quick and efficient way to pack sheet-like electronic devices at a high compression ratio. However, crumpling is not applicable to conventional electronic devices because disordered and irreversible plastic deformation can occur, which affects electronic function. Here we report crumple-recoverable electronics based on heterogenous integration of silver nanowires, a shape memory polymer and an elastomer. Our approach is inspired by the emergence process of butterfly wings, which have variable stiffnesses as they unfold, and allows the mechanical properties of sheet-like devices to transform via thermal modulation from an elastic (2 MPa) state suitable for smoothing out wrinkles formed during crumpling to a plastic (1,315 MPa) state suitable for free-standing operation. We use the approach to create touch panels (7 cm by 7 cm) that can be crumpled and packed into capsules (1 ml volume), and then used as a flat and smooth surface for reliable touch sensing after unpacking.
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Source data are provided with this paper. All other data that support the findings of this study are available from the corresponding authors upon reasonable request.
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Acknowledgements
This work is supported by funding from NRF of Korea (grant no. 2019R1H1A1080221, 2019R1F1A1063066, 2019R1C1C1007629, 2021R1A6A3A13045869, 2022R1A2C2093100, RS-2023-00271830, RS-2023-00277110), the new faculty research fund of Ajou University and the Ajou University research fund. This work was supported by Korea Environment Industry & Technology Institute (KEITI) through Digital Infrastructure Building Project for Monitoring, Surveying, and Evaluating the Environmental Health Program, funded by Korea Ministry of Environment (2021003330009).
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Y.R. led the work. S.L. designed the experiments. D.G., H.K. and M.K. performed mechanical modelling. S.H., D.L., I.H., C.K., S.I., B.K., D.S. and T.K. manufacture the HIS-based touch panel. S.M.W., T.K., J.C. and U.K. contributed analysis of the mechanical characterization for the HIS. J-S.K., D.K. and S. Han supervised the work.
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Nature Electronics thanks Tao Chen, Xuechang Zhou and the other, anonymous, reviewer(s) for their contribution to the peer review of this work.
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Supplementary Methods, Notes 1–7, Figs. 1–24, Table 1 and Videos 1–3.
Supplementary Video 1
Restoring mechanical and electronic malfunctions from the HIS being packed in a cramped cell.
Supplementary Video 2
Comparison of writing on same HIS in different condition.
Supplementary Video 3
Playing on the skin-attachable HIS-based touch panel with low friction.
Source data
Source Data Fig. 2
Source data for Figs. 2h, 2i.
Source Data Fig. 3
Source data for Figs. 3h, 3i, 3d, 3f, 3g.
Source Data Fig. 4
Source data for Figs. 4c, 4f.
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Roh, Y., Lee, S., Won, S.M. et al. Crumple-recoverable electronics based on plastic to elastic deformation transitions. Nat Electron 7, 66–76 (2024). https://doi.org/10.1038/s41928-023-01089-6
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DOI: https://doi.org/10.1038/s41928-023-01089-6
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