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A multimaterial 3D printing-assisted micropatterning for heat dissipation applications

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Abstract

Micropatterned structures have applications in microchips, circuit board designs, microfluidics, evaporator/condenser coils, microelectronics, metasurfaces, and other functional devices. Conventional microfabrication techniques include lithography, vapor deposition, and laser writing. However, these methods have slow processing rates, complex requirements, or costly procedures. As a result, it is challenging to fabricate micropatterned structures onto large-scale surfaces with high production rates and resolution features. Thus, this study focuses on a non-conventional, mask-free micropatterning technique that combines bottom-up 3D printing capable of processing multiple materials and top-down wet etching for selective elimination of sacrificial material. The unique 3D printing, multiphase direct ink writing (MDIW), utilizes various polymer and nanoparticle systems as feedstocks for depositing lamellar structures containing 32–128 sublayers of varying compositions (i.e., wet etchable sacrificial ink and ultraviolet-curable patterning ink). The rapid phase transformation of photosensitive ink (i.e., epoxy and boron nitride (BN)) into solidified features enables “micro-confinement” of the sacrificial ink (i.e., polyethyleneimine). Subsequently, wet etching can locally and selectively dissolve sacrificial polymers by solvent diffusion and polymer dissolution at the polymer–solvent interface. The parameter control (i.e., ink rheology, polymer–polymer interdiffusion, layer multiplication, phase transformation, and solvent-polymer interactions) can precisely tune the lamellar-groove transition, thus forming desirable surfaces or internal microstructures. Microgrooves with a resolution of ≈ 55–170 µm were fabricated by selective wet etching via isopropanol with an etching rate of ≈ 7–11 µg/s. Our hybrid approach, which combines bottom-up 3D printing and top-down wet etching, facilitates surface micropatterning and demonstrates the massive potential of distributing boron nitride nanoparticles for dissipating thermal energies. The micropatterns displayed a thermal conductivity of ≈ 0.2 W/mK for 25wt.% BN with an enhancement of heat dissipation by ≈ 11 °C via confinement of coolants. With production scalability, operation simplicity, and multimaterial compatibility, our 3D-printed micropatterning shows broader applications in nanoparticle assembly, drug delivery, optical lenses, intelligent microbots, and morphing objects.

Graphical Abstract

This technique combines multiphase direct ink writing (MDIW) 3D printing and wet etching capable of micropatterning for thermal management applications.

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Acknowledgements

We would like to thank Dr. D. Bhate from 3DX research for the use of the Keyence 3D Optical profilometer at ASU. We thank Dr. B. Kwon for providing help to use the hot disk at ASU.

Funding

We acknowledge the financial support from the NSF EAGER (Award Abstract #1902172), NSF CAREER (Award #2145895), ONR NEPTUNE (N00014-22–1-2105), AFOSR (FA9550-22–1-0263), BSF (2020102), and ACS PRF (#62371-ND10).

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Authors and Affiliations

  1. Systems Engineering, The School of Manufacturing Systems and Networks (MSN), Ira A. Fulton Schools of Engineering, Arizona State University (ASU), Mesa, AZ, 85212, USA

    Sayli Jambhulkar, Dharneedar Ravichandran, Varunkumar Thippanna & Dhanush Patil

  2. The School of Manufacturing Systems and Networks (MSN), Ira A. Fulton Schools of Engineering, Arizona State University (ASU), Mesa, AZ, 85212, USA

    Kenan Song

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  1. Sayli Jambhulkar
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S. Jambhulkar and K. Song conceptualized and designed a research objective; S. Jambhulkar performed experiments, analyzed results, performed theoretical calculations, and drafted manuscript; D. Ravichandran designed MDIW 3D printing setup and performed fluidic simulation; V. Thippanna, and D. Patil assisted with experiments of 3D printing. All authors reviewed the final manuscript.

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Correspondence to Kenan Song.

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Jambhulkar, S., Ravichandran, D., Thippanna, V. et al. A multimaterial 3D printing-assisted micropatterning for heat dissipation applications. Adv Compos Hybrid Mater 6, 93 (2023). https://doi.org/10.1007/s42114-023-00672-x

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  • DOI: https://doi.org/10.1007/s42114-023-00672-x

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