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The Mechanical and Microstructural Changes of Sn-Ag-Bi Solders with Cooling Rate and Bi Content Variations

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Abstract

The purpose of this study is to investigate the influence of cooling rate and Bi addition on the microstructure evolution and mechanical properties of Sn-3.5Ag alloy. A series of Sn-3.5Ag-xBi solders has been fabricated with Bi content in the range of 0.5-3.5 wt.%. After solution heat treatment at 170 °C for 24 h and subsequent aging heat treatment at 100 °C for 2 h, samples were divided into two groups. One group was rapidly quenched into iced water (water quenching) for the fast cooling rate (20 °C/s), while the second group was slowly cooled (furnace cooling) in the furnace for the slow cooling rate (0.2 °C/s) after the furnace reflow. The microstructural evolutions of the present solders have been investigated using x-ray diffraction and scanning electron microscopy. The microhardness was measured to correlate the mechanical properties to alloy compositions and cooling rate. It was found that the microhardness of Sn-3.5Ag-xBi solders increased with increasing cooling rate. The indentation creep curves have been evaluated from the obtained microhardness values. Results revealed the steady-state creep rate decreased with increasing Bi content exhibiting an anomalous behavior at 2.5Bi. The reason for improved creep resistance of Sn-3.5Ag-xBi solders is the result of the combination of the solid solution strengthening and precipitation strengthening of Bi. The mean values of stress exponent indicated that the operative creep mechanism is dislocation climb.

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Acknowledgment

The authors extend their appreciation to the Deanship of Scientific Research at King Khalid University for funding this work through General Research Project under grant number (G.R.P-260-38).

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Authors and Affiliations

  1. Physics Department, Faculty of Science, King Khalid University, P.O. Box 9004, Abha, 61413, Saudi Arabia

    A. F. Abd El-Rehim, H. Y. Zahran & S. AlFaify

  2. Physics Department, Faculty of Education, Ain Shams University, P.O. Box 5101, Heliopolis, Roxy, Cairo, 11771, Egypt

    A. F. Abd El-Rehim & H. Y. Zahran

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  1. A. F. Abd El-Rehim
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Correspondence to H. Y. Zahran.

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Abd El-Rehim, A.F., Zahran, H.Y. & AlFaify, S. The Mechanical and Microstructural Changes of Sn-Ag-Bi Solders with Cooling Rate and Bi Content Variations. J. of Materi Eng and Perform 27, 344–352 (2018). https://doi.org/10.1007/s11665-017-3104-x

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  • DOI: https://doi.org/10.1007/s11665-017-3104-x

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