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Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading

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Abstract

A novel E-shaped symmetric configuration is proposed and implemented to document deformation evolutions of single-grain solder joints with different orientations. The configuration is fabricated from two metals with different coefficient of thermal expansions to produce precisely-controlled shear-dominant loading to solder joints when subjected to a thermal excursion. Cooling rates during solder solidification are controlled to produce joints with a large single grain of Sn-based Pb-free solder. Moiré interferometry is employed to measure the detailed in-situ deformations of single grain solder joints during a thermal cycle of −40 °C to 125 °C. The results are analyzed to provide the history of grain orientation-dependent inelastic strain evolutions. The results are aimed at calibrating and verifying the anisotropic constitutive models developed for Sn-based Pb-free solder alloys.

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Acknowledgements

The polarizing microscope images shown in Figs. 5 and 6 were obtained at the laboratory of Prof. Sarah Penniston-Dorland (Department of Geology, University of Maryland). Her support during the measurements is gratefully acknowledged.

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Authors and Affiliations

  1. Mechanical Engineering Department, University of Maryland, College Park, MD, 20742, USA

    B. Wu & B. Han

  2. Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA

    J. Schumacher

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  1. B. Wu
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  2. B. Han
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  3. J. Schumacher
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Correspondence to B. Han.

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Wu, B., Han, B. & Schumacher, J. Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading. Exp Mech 59, 1075–1086 (2019). https://doi.org/10.1007/s11340-019-00516-0

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