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Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging

  • Electronic Packaging and Interconnections 2021
  • Published:
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Abstract

With miniaturization and heterogeneous integration in packaging, there has been a drive toward develo** lower temperature solders. Sn-58Bi eutectic solder provides an attractive alternative with its meting point at 138°C. Due to the lower melting temperature of Sn-Bi solder, Bi coarsening may occur even at room temperature. In this paper, the microstructural evolution in Sn-58Bi joints was observed during room temperature storage. Room temperature aging induced the dissolution and coarsening of Bi phases in the solder matrix, especially in the primary Sn phases and Sn-Bi dendrites. The mechanical properties of individual Sn-rich and Bi-rich phases were measured by nanoindentation. The results showed that the Sn-rich phases had higher Young’s modulus and hardness than Bi-rich phases in aged solder joints due to solution strengthening. Bi phases were more compliant and had lower hardness than Sn.

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Acknowledgments

The authors gratefully acknowledge funding from the National Science Foundation (NSF), NSF-CMMI 1763128 (Program Manager: Dr. Alex Lewis). We also acknowledge start-up funds from Purdue University.

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Authors and Affiliations

  1. School of Materials Engineering, Purdue University, West Lafayette, IN, 47906, USA

    Fengjiang Wang, Amey Luktuke & Nikhilesh Chawla

  2. School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212003, China

    Fengjiang Wang

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  1. Fengjiang Wang
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  2. Amey Luktuke
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Correspondence to Nikhilesh Chawla.

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Wang, F., Luktuke, A. & Chawla, N. Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging. J. Electron. Mater. 50, 6607–6614 (2021). https://doi.org/10.1007/s11664-021-09255-2

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