SpringerLink
Log in

Effect of minor Sb addition on microstructure, interfacial behavior, and mechanical properties of Sn–15Bi solder joints

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

This paper focuses on the effect of adding minor Sb with different content (1–3 wt.%) into Sn–15Bi solder to improve the microstructure, mechanical properties, and interfacial behavior of solder joints. The inclusion of Sb in Sn–15Bi solder joints resulted in the refinement of Bi particles in microstructure and some improvement in both tensile strength and hardness of bulk solder alloys. During soldering, the Sb addition slightly increased the thickness of interfacial intermetallic compounds (IMCs) in the solder joints. However, during isothermal aging, Sb in Sn–15Bi solder effectively inhibited the growth of interfacial IMCs as the isothermal aging time increased due to the formation of Sn–Sb compounds and Cu6(Sn, Sb)5 IMCs. This inhibition improved the shear strength and reliability of Sn–15Bi-based solder joints during isothermal aging.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17
Fig. 18
Fig. 19
Fig. 20

Similar content being viewed by others

Data availability

The data and materials that support the findings of this study are available from the corresponding author upon reasonable request.

References

  1. C. Morando, O. Fornaro, O. Garbellini, H. Palacio, Thermal properties of Sn-based solder alloys. J. Mater. Sci. Mater. Electron. 25(8), 3440–3447 (2014)

    Article  CAS  Google Scholar 

  2. S. Cheng, C.-M. Huang, M. Pecht, A review of lead-free solders for electronics applications. Microelectron. Reliab. 75, 77–95 (2017)

    Article  CAS  Google Scholar 

  3. G. Chen, X.H. Wang, J. Yang, W.L. Xu, Q. Lin, Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders. Microelectron. Reliab. (2020). https://doi.org/10.1016/j.microrel.2020.113634

    Article  Google Scholar 

  4. F. Wang, H. Chen, Y. Huang, L. Liu, Z. Zhang, Recent progress on the development of Sn–Bi based low-temperature Pb-free solders. J. Mater. Sci. Mater. Electron. 30(4), 3222–3243 (2019)

    Article  CAS  Google Scholar 

  5. L.S. Kamaruzzaman, Y. Goh, Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review. Solder. Surf. Mount Technol. 34(5), 300–318 (2022)

    Article  Google Scholar 

  6. F. Wang, Y. Huang, Z. Zhang, C. Yan, Interfacial reaction and mechanical properties of Sn-Bi solder joints. Materials (Basel) (2017). https://doi.org/10.3390/ma10080920

    Article  PubMed  PubMed Central  Google Scholar 

  7. L. Yang, C. Du, J. Dai, N. Zhang, Y. **g, Effect of nanosized graphite on properties of Sn–Bi solder. J. Mater. Sci. Mater. Electron. 24(11), 4180–4185 (2013)

    Article  CAS  Google Scholar 

  8. V. Jayaram, O. Gupte, K. Bhangaonkar, C. Nair, A review of low-temperature solders in microelectronics packaging. IEEE Trans. Compon. Packag. Manufac. Technol. 13(4), 570–579 (2023)

    Article  CAS  Google Scholar 

  9. F. Wang, A. Lutuke and N. Chawla. Microstructural coarsening and mechanical properties of eutectic Sn-58Bi solder joint during aging. J. Electron. Mater. 50, 6607–6614 (2021)

    Article  CAS  Google Scholar 

  10. A. Yamauchi, M. Kurose, Effect of Sb and Zn addition on the microstructures and tensile properties of Sn-Bi-based alloys. Materials (Basel) (2022). https://doi.org/10.3390/ma15030884

    Article  PubMed  Google Scholar 

  11. Y. Ma, X. Li, W. Zhou, L. Yang, P. Wu, Reinforcement of graphene nanosheets on the microstructure and properties of Sn58Bi lead-free solder. Mater. Des. 113, 264–272 (2017)

    Article  CAS  Google Scholar 

  12. J. Yang, Q. Zhang, Z. Song, Influences of Ag and In alloying on microstructure and mechanical properties of Sn-58Bi solder. J. Electron. Mater. 50(1), 283–290 (2020)

    Article  Google Scholar 

  13. L. Zhang, Z.-Q. Liu, Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm). J. Mater. Sci. Mater. Electron. 31(3), 2466–2480 (2020)

    Article  CAS  Google Scholar 

  14. X. Huang, L. Zhang, C. Chen, X. Lu, X. Wang, Comprehensive analysis of Sn58Bi/Cu solder joints reinforced with Mg particles: Wettability, thermal, mechanics, and microstructural characterization. J. Market. Res. 27, 2641–2655 (2023)

    CAS  Google Scholar 

  15. J.L. Paixão, L.F. Gomes, R.V. Reyes, A. Garcia, J.E. Spinelli, B.L. Silva, Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys. Mater. Charact. (2020). https://doi.org/10.1016/j.matchar.2020.110445

    Article  Google Scholar 

  16. W. Chen, L. Zhang, Y. Du, Diffusivities and atomic mobilities in Sn–Ag–In and Sn–Ag–Sb melts. Calphad 52, 159–168 (2016)

    Article  CAS  Google Scholar 

  17. X. Wang, L. Zhang, M.-L. Li, Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review. J. Mater. Sci. Mater. Electron. 33(5), 2259–2292 (2021)

    Article  CAS  Google Scholar 

  18. C. Zhang, S.-D. Liu, G.-T. Qian, J. Zhou, F. Xue, Effect of Sb content on properties of Sn—Bi solders. Trans. Nonferrous Met. Soc. China 24(1), 184–191 (2014)

    Article  CAS  Google Scholar 

  19. H.N. Fowler, A. Loaiza, D.F. Bahr, J.E. Blendell, C.A. Handwerker, Sb additions in near-eutectic Sn-Bi solder decrease planar slip. J. Electron. Mater. 52(11), 7365–7370 (2023)

    Article  CAS  Google Scholar 

  20. Z. Lai, D. Ye, Microstructure and fracture behavior of non eutectic Sn–Bi solder alloys. J. Mater. Sci. Mater. Electron. 27(4), 3182–3192 (2016)

    Article  CAS  Google Scholar 

  21. Y.-A. Shen, Bi dispersion hardening in Sn-Bi alloys by solid-state aging. JOM 75(11), 4922–4930 (2023)

    Article  CAS  Google Scholar 

  22. F. Wang, Y. Ding, L. Liu, Y. Huang, M. Wu, Wettability, interfacial behavior and joint properties of Sn-15Bi solder. J. Electron. Mater. 48(10), 6835–6848 (2019)

    Article  CAS  Google Scholar 

  23. W. Lin, X. Li, B. Tu, C. Zhang, Y. Li, Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures. Sold. Surf. Mount Technol. 35(4), 218–230 (2023)

    Article  Google Scholar 

  24. H. Sun, Y.C. Chan, F. Wu, Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs. J. Mater Sci. Mater. Electron. 29(10), 8584–8593 (2018)

    Article  CAS  Google Scholar 

  25. S. Liu, T. Song, W. **ong, L. Liu, Z. Liu, S. Huang, Effects of Ag on the microstructure and shear strength of rapidly solidified Sn–58Bi solder. J. Mater. Sci. Mater. Electron. 30(7), 6701–6707 (2019)

    Article  CAS  Google Scholar 

  26. B.L. Chen, G.Y. Li, Influence of Sb on IMC growth in Sn–Ag–Cu–Sb Pb-free solder joints in reflow process. Thin Solid Films 462–463, 395–401 (2004)

    Article  Google Scholar 

  27. A. Torres, L. Hernández, O. Domínguez, Effect of antimony additions on corrosion and mechanical properties of Sn-Bi eutectic lead-free solder alloy. Mater. Sci. Appl. 03(06), 355–362 (2012)

    CAS  Google Scholar 

  28. S. Lidin, S.Y. Piao, The structure of Cu6Sn5-xSbx – large effects of subtle do**. Z. Anorg. Allg. Chem. 635(4–5), 611–613 (2009)

    Article  CAS  Google Scholar 

  29. W. Yang, X. Quy Tran, T. Yamamoto, S. Yoshioka, F. Somidin, K. Nogita, S. Matsumura, Atomic locations of minor dopants and their roles in the stabilization ofη−Cu6Sn5. Phys. Rev. Mater. (2020). https://doi.org/10.1103/PhysRevMaterials.4.065002

    Article  Google Scholar 

  30. W. Yang, Y. Ding, M. Liao, F. Wang, Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling. J. Mater. Sci. Mater. Electron. 33(21), 17137–17151 (2022)

    Article  CAS  Google Scholar 

  31. K.N. Tu, A.M. Gusak, M. Li, Physics and materials challenges for lead-free solders. J. Appl. Phys. 93(3), 1335–1353 (2003)

    Article  CAS  Google Scholar 

  32. A. Kumar, Z. Chen, Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5Ag reaction couple. J. Electron. Mater. 40(2), 213–223 (2010)

    Article  Google Scholar 

Download references

Funding

This research was funded by the National Natural Science Foundation of China, Grant No. 51875269, and by Postgraduate Research & Practice Innovation Program of Jiangsu Province, Grant No. SJCX23_2178.

Author information

Authors and Affiliations

  1. School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212003, People’s Republic of China

    Fengjiang Wang, Pengcheng Lv & Jiayu Zhang

Authors
  1. Fengjiang Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Pengcheng Lv
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Jiayu Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

PL: methodology, formal analysis, data curation, and writing. JZ: methodology, formal analysis, and data curation. FW: conceptualization, methodology, and writing–review & editing.

Corresponding author

Correspondence to Fengjiang Wang.

Ethics declarations

Conflict of interest

The authors declare that they have no conflict of interest.

Ethical approval

This article does not contain any studies with human tissues or animals performed by any of the authors.

Consent to participate

This research is not related to human subjects.

Consent for publication

The author assigns non-exclusive publication rights to Springer and warrants that his contribution is unique and that he possesses all necessary authority to make this grant. The author assumes responsibility for the material’s release on behalf of all co-authors. This assignment of publication rights includes the non-exclusive right to reproduce and distribute the article in any format, including reprints, translations, photographic reproductions, microform, electronic form (offline, online), or other reproductions of a similar nature.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Wang, F., Lv, P. & Zhang, J. Effect of minor Sb addition on microstructure, interfacial behavior, and mechanical properties of Sn–15Bi solder joints. J Mater Sci: Mater Electron 35, 1274 (2024). https://doi.org/10.1007/s10854-024-13013-5

Download citation

  • Received:

  • Accepted:

  • Published:

  • DOI: https://doi.org/10.1007/s10854-024-13013-5

Search

Navigation