Abstract
Consumer electronic products, particularly mobile devices such as mobile phones, thermal scanners, tablets and laptop computers, contain BGA packages and assemblies. These devices are susceptible to impact loading from unintentional drop** of the device during operation and handling. Such loading transfers the induced mechanical shock to solder joints in the electronic assembly that could initiate damage, leading to premature failure of the solder joints. Consequently, mechanical shock loading is considered in reliability assessment of solder joints. Impact loading is introduced through a board-level drop test of a PCB with a surface mounted electronic assembly containing BGA solder joints.
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Albrecht, H.-J., Juritza, A., Müller, K., Müller, W.H., Sterthaus, J., Villain, J., et al.: Interface reactions in microelectronic solder joints and associated intermetallic compounds: an investigation of their mechanical properties using nanoindentation. In: 5th Electronics Packaging Technology Conference, pp. 726–731 (2003)
Anand, L.: Constitutive equations for hot-working of metals. Int. J. Plast. 1(3), 213–231 (1985)
Darveaux, R., Reichman, C.: Ductile-to-brittle transition rate. In: 8th Electronics Packaging Technology Conference, 283–289 (2006)
JEDEC, JESD22-B111: Board Level Drop Test Method of Components for Handheld Electronic Products (2003)
JEDEC, JESD22-B104C: Mechanical Shock (2004)
Kim, I., Lee, S.-B.: Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load. IEEE Trans. Compon. Packag. Technol. 31(2), 478–484 (2008)
Lai, Z.B.: Classical and damage mechanics-based models for lead-free solder interconnect. Master Thesis, Universiti Teknologi Malaysia, Malaysia (2009)
Lai, Y.-S., Yang, P.-F., Yeh, C.-L.: Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectron. Reliab. 46(2–4), 645–650 (2006)
Lai, Y.-S., Yang, P.-C., Yeh, C.-L.: Effects of different drop test conditions on board-level reliability of chip-scale packages. Microelectron. Reliab. 48(2), 274–281 (2008)
Liu, F., et al.: Board level drop test analysis based on modal test and simulation. J. Electron. Packag. 130(2), 021007 (2008)
Park, T.-S.: A study on mechanical fatigue behaviors of ball grid array solder joints for electronic packaging. Korea Advanced Institute of Science and Technology (KAIST), Daejeon (2004)
Sano, M., Chou, C.-Y., Hung, T.-Y. and Yang, S.-Y.: Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test. 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 1–6 (2009)
Schubert, A., et al.,: Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation. In: Proceedings of 53rd Electronic Components and Technology Conference (2003)
Tong Yan, T. et al.: Novel numerical and experimental analysis of dynamic responses under board level drop test. Thermal and mechanical simulation and experiments in microelectronics and microsystems. In: Proceedings of the 5th International Conference on EuroSimE (2004)
Wong, E.H., Rajoo, R., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Leoni, M., Eu, P.L., Lai, Y.-S., Yeh, C.-L.: Correlation studies for component level ball impact shear test and board level drop test. Microelectron. Reliab. 48(7), 1069–1078 (2008)
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Tamin, M.N., Shaffiar, N.M. (2014). Application III: Board-Level Drop Test. In: Solder Joint Reliability Assessment. Advanced Structured Materials, vol 37. Springer, Cham. https://doi.org/10.1007/978-3-319-00092-3_8
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DOI: https://doi.org/10.1007/978-3-319-00092-3_8
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