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1. Atomic scale investigation of interfacial damage initiation in SnPb alloy: structural stability and defect-interface interactions

   In this paper, the initiation of interfacial damage in SnPb alloy was investigated at the atomic scale through molecular dynamics simulations. The...

   Ruisi **ng, Changwei Wang, ... Chuantao Hou in Journal of Materials Science

   Article 05 June 2024
   

2. A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue

   A combination of nanoindentation map** and machine-earning (ML) modeling has been used to characterize the microstructural changes in SnPb solder...

   R. Rakhmat Kurniawan, Biju Theruvil Sayed, ... Naseer Ali Hussien in Journal of Electronic Materials

   Article 20 April 2023
   

3. The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints

   The reliability of SnPbAg solder joints containing gold (Au) under different aging conditions have been investigated. The solder joints were prepared...

   Yinghao Bi, Weiqi Guo, ... ** Wu in Journal of Electronic Materials

   Article 28 June 2024
   

4. Thermomigration-induced failure in ball grid array solder joint under high current stressing

   In this work, rapid failure of a few minutes was observed in real ball grid array solder joints under high current density (8 × 10 ³ and 1 × 10 ⁴  A cm ⁻² ...

   Peng Liu, Sen Cong, ... ** Wu in Journal of Materials Science

   Article 18 June 2023
   

5. Influences of low In alloying and aging on microstructure and plastic deformation behavior of Sn-58Bi solder

   The SnBi eutectic solder shows high ductility at low strain rate, while plastic deformation of the Sn-rich phase in it is restrained due to the high...

   He Zhang, Qingke Zhang, Zhenlun Song in Journal of Materials Science: Materials in Electronics

   Article 20 June 2024
   

6. Impact of Gold Thickness on Interfacial Evolution and Subsequent Embrittlement of Tin–Lead Solder Joints

   Although gold remains a preferred surface finish for components used in high-reliability electronics, rapid developments in this area have left a gap...

   Rebecca Wheeling, Paul Vianco, ... Dorina F. Sava Gallis in Journal of Electronic Materials

   Article 20 September 2022
   

7. The Comprehensive Effect of Electronic Irradiation and Thermal Cycling on the Thermal and Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Joints

   The rapid development of aerospace electronics towards lightweight and miniaturized designs has put forward higher requirements for the reliability...

   Chencheng Wu, Yang Liu, ... Chaoyang **ng in Journal of Electronic Materials

   Article 09 July 2024
   

8. Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging

   Different amounts of Fe (0.005, 0.01, 0.03, 0.05, and 0.07 wt%) were added to SAC305 to study the shear behavior damage of Fe-doped SAC solder joints...

   Quanzhen Li, Chengming Li, ... **aohong Yuan in Acta Metallurgica Sinica (English Letters)

   Article 15 April 2024
   

9. Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach

   Rapid and accurate reliability assessment of electronic devices is a key issue in device design. In this work, a machine learning algorithm was...

   Tzu-Chia Chen, Maria Jade Catalan Opulencia, ... Aravindhan Surendar in Journal of Electronic Materials

   Article 26 April 2022
   

10. Preventing Void Growth Between Ni₃Sn₄ and Solder

    An increasing number of applications of microelectronics products involve multiple reflows and/or extended operation at temperatures high enough that...

    M. Njuki, S. Thekkut, ... N. Dimitrov in Journal of Electronic Materials

    Article 17 August 2022
    

11. Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure

    In this study, the influence of different reflow profiles and dosages of SnPb solder paste on the reliability of the SnAgCu/SnPb mixed assembly...

    Li-Yin Gao, **an-Wei Cui, ... Zhi-Quan Liu in Journal of Electronic Materials

    Article 13 August 2020

12. Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps

    Abstract

    To understand the size effect on electromigration (EM) behavior in flip chip Pb-free Sn-3.5Ag solder bumps, EM tests were performed with...

    Gahui Kim, Kirak Son, ... Young-Bae Park in Electronic Materials Letters

    Article 04 July 2022
    

13. Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material

    This paper investigates the impact of various copper (Cu) pillar bump heights on temperature distribution, deformation and thermal stress during...

    **g Rou Lee, Mun ** Chong, ... F. Che Ani in Journal of Electronic Materials

    Article 05 November 2023
    

14. Fabrication and properties of NiO-modified Al₂O₃ reinforced Sn1.0Ag0.5Cu composite solder and soldering performance

    NiO-modified Al ₂ O ₃ (NiO–Al ₂ O ₃ ) as the reinforcing phase of solder matrix was prepared by impregnation method, and then, the prepared reinforcing phase...

    Bingying Wang, Yong** Wu, ... Keke Zhang in Journal of Materials Science

    Article 23 September 2022
    

15. Effects of Bi Addition on the Solderability and Mechanical Properties of Sn-Zn-Cu Lead-Free Solder

    In the present work, the effects of Bi addition on the microstructure, solderability, and mechanical properties of Sn-Zn-Cu lead-free solder were...

    Cunji Pu, Jialong Qiu, ... Jianhong Yi in Journal of Electronic Materials

    Article 16 June 2022
    

16. Molecular Dynamic of the Nanoparticle Reinforcement in the Pb-Free Solder During Reflow Soldering Process

    Nano-reinforcement in Pb-free solder has emerged as a potential alternative to improve lead-free solder’s mechanical and physical properties. With...

    Mohd Sharizal Abdul Aziz, I. N. Sahrudin, ... Mohd Arif Anuar Mohd Salleh in Recent Progress in Lead-Free Solder Technology

    Chapter 2022
    

17. Strengthening mechanism of Ni-modified graphene nanosheets reinforced SnAgCuRE composite solder/Cu joints

    Based on the unique structure, excellent physical and mechanical properties of graphene nanosheets (GNSs), thermal decomposition method was used to...

    Huigai Wang, Keke Zhang, ... Bingying Wang in Journal of Materials Science: Materials in Electronics

    Article 26 October 2021
    

18. Application of deep neural network in fatigue lifetime estimation of solder joint in electronic devices under vibration loading

    Comprehensive rapid reliability analysis of electronic devices in the design level while simultaneously considering all the crucial parameters is...

    Anas A. Salameh, Hossein Hosseinalibeiki, Sami Sajjadifar in Welding in the World

    Article 18 July 2022
    

19. Recent advances on SnBi low-temperature solder for electronic interconnections

    SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its excellent creep resistance, relatively low melting point...

    Nan Jiang, Liang Zhang, ... Peng He in Journal of Materials Science: Materials in Electronics

    Article 26 August 2021
    

20. Research on the Mechanical and Performance Effects of Flux on Solder Layer Interface Voids

    This article focuses on the study of voids in the solder joint interface of flip-chip LEDs. Additional flux is added to the solder paste to reduce...

    **nmeng Zhai, Yue Chen, ... **aofeng Su in Journal of Electronic Materials

    Article 27 August 2021