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Influence of Reduction and Annealing Temperature on the Interface Characteristics of Al/Cu Laminated Composite Plates in RHR
Al/Cu laminated composite plates were prepared using rolling with a heated roll method, and after rolling the interface morphology, phase, and...
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Effect of annealing on properties of Al/steel composite plates prepared by surface oxidation treatment before cold roll bonding
Al/steel composite plate has a wide application prospect, but great differences in properties between Al and steel are observed. It is difficult to...
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Soldering, Brazing and Adhesive Bonding
SolderingSoldering is a process of joining metals and alloys without melting them by means of a fusible alloy, called solder. -
The adaption, evaluation and application of a semi-empirical bond strength model for the simulations of multi-pass hot roll bonding of aluminium alloys
Nowadays, the requirements on metallic materials have become more comprehensive, which gradually exceed the capability of monolithic metals. One of...
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Cold spray deposition of cermets: insights into bonding mechanism and critical parameters
The cold spray (CS) process is an advanced material deposition method that has emerged as a versatile method to create high-performance coatings and...
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Bonding of cast iron-aluminum in bimetallic castings by high-pressure die casting process
A practical bimetallic casting consisting of aluminum matrix and cast iron inserts was manufactured via high-pressure die casting (HPDC) process....
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Interface optimization of graphene paper–Cu composite prepared by electrodeposition
A room-temperature electrodeposition method with an organic electrolyte was developed to fabricate a HNO 3 -pretreated graphene paper Cu (GP′–Cu)...
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From fundamental concepts to recent developments in the adhesive bonding technology: a general view
Adhesive bonding is a constantly develo** technique, and the volume of its industrial applications is rapidly increasing, which, in turn, requires...
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Shear Performance of Interface Between Normal Concrete and Ultra-high Performance Concrete in Cryogenic Circumstance
Ultra-high performance concrete(UHPC) is known for its high strength, high toughness and durability, which makes UHPC be seen as a promising... -
Dissimilar material joining of densified superwood to aluminum by adhesive bonding
Superwood is a densified wood product that shows promise as a lightweight and renewable alternative for metallic materials. In order for this...
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Cumulative damage and bearing capacity attenuation law of anchorage structure interface under cyclic loading and unloading
The specimens of anchorage structures bonded by different anchoring materials are prepared to study the damage and reduced safety and reliability...
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Experimental study of shear behavior of rock–shotcrete interface under dynamic shearing: insights from interface roughness and strain rate
Rock–shotcrete structures are often suffered from dynamic shearing. However, the understanding of the dynamic shear response of rock–shotcrete...
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Surface topology modification using 3D printing techniques to enhance the interfacial bonding strength between polymer substrates and prepreg carbon fibre-reinforced polymers
Carbon fibre-reinforced polymers (CFRPs) are increasingly utilised in combination with plastics and metals to manufacture hybrid components. Although...
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Influence of rotation speed on interfacial bonding mechanism and mechanical performance of aluminum 6061 fabricated by multilayer friction-based additive manufacturing
Friction-based additive manufacturing processes that allow the free design of the deposition path are expected to be used for the rapid production of...
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Regulating microstructure and mechanical property of dissimilar joints by pretreatments of S31042 steel and Ni3Al-based superalloy bonding substrates
For the bonding couple of S31042 steel and Ni 3 Al-based superalloy, joint microstructure regulation plays a pivotal role in improving joint...
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Hybrid Bonding
First of all, the focus of this chapter is on silicon-to-siliconSilicon-to-silicon flip chip bonding and is not for silicon-to-organic substrate flip... -
Two material removal modes in chemical mechanical polishing: mechanical plowing vs. chemical bonding
With the rapid development of semiconductors, the number of materials needed to be polished sharply increases. The material properties vary...
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Interface Shear Failure Behavior Between Normal Concrete (NC) and Ultra-High Performance Concrete (UHPC)
Ultra-high performance concrete (UHPC) with excellent mechanical properties and durability is a promising material for reinforcement of existing...
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Failure of adhesive bonding unveiled by in-situ strain testing by high-resolution scanning transmission electron microscopy
The nano-scale failure behaviors of adhesive interfaces were investigated through in-situ straining testing to observe real-time crack propagations...
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Optical bonding process of flat panel displays and their critical-to-quality factors
Automotive and display manufacturers have been working on several products and production processes to allow automakers to produce the best display...