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    Effect of pre-soldering temperatures on the microstructures and shear behaviors of SnBi-SAC/ENIG solder joints

    ​Thermal deformation during soldering between the chip and the substrate is an important factor affecting the quality of high-density packaging of organic circuit boards. This study proposes a low-temperature ...

    Shiqing Lv, Yang Liu, Yuxiong Xue… in Journal of Materials Science: Materials in… (2024)