41 Result(s)

Chapter and Conference Paper

Some algebras of bounded analytic functions containing the disk algebra

S. Y. Chang, D. E. Marshall in Banach Spaces of Analytic Functions (1977)

Article

Location by paper chromatography of compensatory ovarian hypertrophy (COH) inhibiting activity in acetic acid extracts from bovine pineals

Acetic acid extracts of bovine pineals and cerebral cortex were separated on Sephadex G-25 columns. Subsequently two low molecular weight fractions, F₂ and F₃, were ultrafiltered through the membranes UM2 and UM0...

I. Ebels, B. Benson, C. F. Bria, D. McDonnell… in Journal of Neural Transmission (1978)

Chapter

Comparative Pharmacokinetics of Chlorambucil and Melphalan in Man

We have studied the pharmacokinetics of orally administered chlorambucil and melphalan in patients with hematologic malignancies and solid tumors. With a standard oral dose of 0.6 mg/kg, chlorambucil showed mu...

D. S. Alberts, S. Y. Chang, H.-S. G. Chen… in Cancer Chemo- and Immunopharmacology (1980)

Chapter

The Disposition of Intraperitoneal Bleomycin, Melphalan, and Vinblastine in Cancer Patients

We have studied the disposition of bleomycin, melphalan, or vinblastine after intraperitoneal (IP) instillation in 14 cancer patients. Although IP bleomycin had a somewhat longer terminal-phase plasma half-lif...

D. S. Alberts, H.-S. G. Chen, S. Y. Chang… in Cancer Chemo- and Immunopharmacology (1980)

Article

Inhibition of human tumour clonogenicity by chlorambucil and its metabolites

G E Goodman, A McLean, D S Alberts, S Y Chang in British Journal of Cancer (1982)

Chapter

Incorporation of Porcine Thymic Peptides into the Treatment of Fulminant Viral Hepatitis

Fulminant viral hepatitis is a serious disorder resulting from massive hepatic necrosis or sudden and severe impairment of liver function in a patient who has had no evidence of previous liver disease. Lately,...

S. Su, Z. Y. Cui, S. Y. Chang, J. Y. Shi, W. P. Dao… in Thymic Hormones and Lymphokines (1984)

Article

Coagulation kinetics of amorphous colloidal silica suspensions with and without hydroxypropyl cellulose polymer

The coagulation rate constant of submicron silica has been measured as a function of solution pH, salt concentration and hydroxypropyl cellulose (HPC) polymer concentration. Results show that the colloidal sta...

S. Y. Chang, T. A. Ring, E. M. Trujillo in Colloid and Polymer Science (1991)

Article

Intraspecific protoplast fusion of Candida tropicalis for enhancing phenol degradation

Auxotrophic mutants and phenol-degrading defective mutants were separately isolated in a phenol-utilizing strain of Candida tropicalis M4, and were hybridized through protoplast fusion. Some protoplast fusants wi...

S. Y. Chang, C. T. Li, S. Y. Hiang, M. C. Chang in Applied Microbiology and Biotechnology (1995)

Article

Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements

The corrosion behaviors of a series of Al-Si-Cu-based filler metals and the 6061-T6 butt joints brazed with these filler metals are evaluated by polarization tests and immersion tests in a 3.5% NaCl aqueous so...

T. L. Su, S. S. Wang, L. C. Tsao… in Journal of Materials Engineering and Perfo… (2002)

Article

Phase identification and growth kinetics of the intermetallic compounds formed during in-49Sn/Cu soldering reactions

For the application of In-49Sn solder in bonding recycled-sputtering targets to Cu back plates, the intermetallic compounds formed at the In-49Sn/Cu interface are investigated. Scanning electron microscopy (SE...

T. H. Chuang, C. L. Yu, S. Y. Chang, S. S. Wang in Journal of Electronic Materials (2002)

Article

Morphology and growth kinetics of Ag₃Sn during soldering reaction between liquid Sn and an Ag substrate

For the soldering of recycled Ag sputtering targets, the interfacial reaction between liquid Sn and an Ag substrate at temperatures ranging from 250 –425°C has been investigated. Experimental results show that...

T. L. Su, L. C. Tsao, S. Y. Chang… in Journal of Materials Engineering and Perfo… (2002)

Article

Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films

The interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films are investigated in the temperature range from 250–325 °C, and the morphology of intermetallic compounds formed after such solder...

T. L. Su, L. C. Tsao, S. Y. Chang… in Journal of Materials Engineering and Perfo… (2002)

Article

Topology optimization of the primary mirror of a multi-spectral camera

A study of the topology optimization of a multi-spectral camera for space-use is presented. The optimization is carried out under self-weight and polishing pressure loading. As an objective function, a measure...

K.S. Park, S.Y. Chang, S.K. Youn in Structural and Multidisciplinary Optimization (2003)

Article

Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages

The intermetallic compounds formed at the interfaces between In-49Sn solder balls and Au/Ni/Cu pads during the reflow of In-49Sn solder, ball-grid array (BGA) packages are investigated. Various temperature pro...

T. H. Chuang, S. Y. Chang, L. C. Tsao, W. P. Weng… in Journal of Electronic Materials (2003)

Article

Joining alumina to inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal

Alumina ceramics were brazed to Inconel 600 and UMCo-50 superalloys at 900 °C for 10 min using an Sn10Ag4Ti active filler metal. The brazing filler showed good wettability on alumina and superalloys. The flexu...

S. Y. Chang, Y. T. Hung, T. H. Chuang in Journal of Materials Engineering and Performance (2003)

Article

Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler

Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 °C in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investiga...

S. Y. Chang, L. C. Tsao, M. J. Chiang… in Journal of Materials Engineering and Perfo… (2003)

Article

Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al₂O₃ with Sn interlayers

The multilayer thin-film systems of Cu/Ti/Si and Au/Cu/Al₂O₃ were diffusion-soldered at temperatures between 250°C and 400°C by inserting a Sn thin-film interlayer. Experimental results showed that a double layer...

M. W. Liang, T. E. Hsieh, S. Y. Chang, T. H. Chuang in Journal of Electronic Materials (2003)

Article

Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates

Intermetallic compounds formed during the soldering reactions between Sn-3.5Ag and Cu at temperatures ranging from 250°C to 375°C are investigated. The results indicate that scallop-shaped η-Cu₆(Sn_0.933 Ag_0.007)₅

T. H. Chuang, H. M. Wu, M. D. Cheng, S. Y. Chang… in Journal of Electronic Materials (2004)

Article

Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad

The intermetallic compounds formed after reflow and burn-in testing of a Sn-20In-0.8Cu solder ball grid array (BGA) package are investigated. Along with the formation of the Cu₆(Sn_0.78In_0.22)₅ precipitates (IM1) ...

M. J. Chiang, S. Y. Chang, T. H. Chuang in Journal of Electronic Materials (2004)

Article

Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages

After reflow of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder balls on Au/Ni surface finishes in ball grid array (BGA) packages, scallop-shaped intermetallic compounds (Cu_0.70Ni_0.28Au_0.02)₆Sn₅ (IM1a) and (Cu_0.76Ni_0...

M. D. Cheng, S. Y. Chang, S. F. Yen, T. H. Chuang in Journal of Electronic Materials (2004)