Abstract
For the soldering of recycled Ag sputtering targets, the interfacial reaction between liquid Sn and an Ag substrate at temperatures ranging from 250 –425°C has been investigated. Experimental results show that a scallop-shaped layer of Ag3Sn intermetallic compounds formed during the soldering reaction. Kinetics analysis indicated that the growth of such interfacial Ag3Sn intermetallic compounds is diffusion-controlled with activation energy of 70.3kJ/mol. During the reaction, the Ag substrate dissolves into the molten Sn solder and causes the appearance of needle-shaped Ag3Sn precipitates in the Sn matrix.
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Su, T.L., Tsao, L.C., Chang, S.Y. et al. Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate. J. of Materi Eng and Perform 11, 365–368 (2002). https://doi.org/10.1361/105994902770343872
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DOI: https://doi.org/10.1361/105994902770343872