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  1. No Access

    Book

    Three-Dimensional Integration of Semiconductors

    Processing, Materials, and Applications

    Kazuo Kondo, Morihiro Kada… (2015)

  2. No Access

    Chapter

    Research and Development History of Three-Dimensional Integration Technology

    The first chapter of the book introduces research and development history of three-dimensional (3D) integration technology. Concept of through-Si via (TSV) is old but the industrialization of 3D integration te...

    Morihiro Kada in Three-Dimensional Integration of Semiconductors (2015)

  3. No Access

    Chapter

    Dream Chip Project at ASET

    Chapter 9 introduces the results of Japanese national research and development (R&D) initiative of 3D integration technology using through-silicon via (TSV) over the 5-year period from 2008 to 2012. Associatio...

    Morihiro Kada, Harufumi Kobayashi… in Three-Dimensional Integration of Semicondu… (2015)

  4. No Access

    Chapter

    Recent Research and Development Activities of Three-Dimensional Integration Technology

    The second chapter describes the recent research and development history of three-dimensional (3D) integration technology. In this chapter we can see so many development activities in the word from 2013. It to...

    Morihiro Kada in Three-Dimensional Integration of Semiconductors (2015)