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Recent Research and Development Activities of Three-Dimensional Integration Technology

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Three-Dimensional Integration of Semiconductors

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Abstract

The second chapter describes the recent research and development history of three-dimensional (3D) integration technology. In this chapter we can see so many development activities in the word from 2013. It took 45 years from the beginning of TSV research and development for industry to begin high-volume manufacturing devices with this technology. Although some challenges related to reliability and cost remain.

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Authors and Affiliations

  1. Osaka Prefecture University, Sakai, Osaka, Japan

    Morihiro Kada

  2. The National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki, Japan

    Morihiro Kada

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  1. Morihiro Kada
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Correspondence to Morihiro Kada .

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Editors and Affiliations

  1. Department of Chemical Engineering, Osaka Prefecture University, Osaka, Japan

    Kazuo Kondo

  2. AIST , Tsukuba, Ibaraki, Japan

    Morihiro Kada

  3. Toshiba Corporation, Oita, Japan

    Kenji Takahashi

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Kada, M. (2015). Recent Research and Development Activities of Three-Dimensional Integration Technology. In: Kondo, K., Kada, M., Takahashi, K. (eds) Three-Dimensional Integration of Semiconductors. Springer, Cham. https://doi.org/10.1007/978-3-319-18675-7_2

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