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  1. No Access

    Article

    Whisker Nucleation by Slip-Assisted Grain Rotation During Thermal Cycling

    As a result of thermal cycling, polycrystalline tin films with a large in-plane grain size relative to film thickness on copper substrates show grain boundary (GB) sliding, creep, yielding, and nucleation of s...

    Congying Wang, **aorong Cai, Marisol Koslowski, John Blendell, Carol Handwerker in JOM (2024)

  2. No Access

    Article

    Mechanical Failure of Cu-Sn Solder Joints

    The effects of the microstructure on the fracture mechanisms of Cu-Sn intermetallic compounds (IMC) in solder joints under tensile load are studied with numerical simulations. When solder joints are exposed to...

    **aorong Cai, Andrew M. Pham, Marisol Koslowski in Journal of Electronic Materials (2021)

  3. No Access

    Article

    Validation of strain invariant failure analysis in an open hole off-axis specimen

    We present a model that incorporates the effect of uncertainty in the microstructure of composite systems in failure analysis. The method involves a recently developed micromechanical enhancement model to inte...

    Alvaro J. Mendoza Jasso, Johnathan E. Goodsell, R. Byron Pipes, Marisol Koslowski in JOM (2011)