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  1. No Access

    Article

    Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy

    In-48Sn eutectic solder is an ideal candidate for flexible electronics equipment packaging because of its low melting point (118 °C) and low electrical resistivity (0.14 × 10–6 Ω·m), but its low tensile strength ...

    Lingmin Ye, **aodong Li, Mu Zhang, Qi zhu… in Journal of Materials Science: Materials in… (2024)

  2. No Access

    Article

    Synthesis of Bi–Pb–Sn–Cd solder particles for joining Ag-plated PZT ceramics at 100 °C

    The rapid development of current multifunctional and flexible electronics has posed increased demand for low-temperature solder materials. The joining of Ag-plated PZT ceramics at a low soldering temperature ...

    Lingmin Ye, Yusheng Liu, Hongliang He… in Journal of Materials Science: Materials in… (2022)