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Article
Effects of microstructures on corrosion and stress corrosion behaviors of an Al-12.1 at.% Zn alloy
Various heat treatments of an Al-12.1 at.% Zn alloy would bring forth various types of microstructures such as solid solution (SS), continuous precipitation (CP), and discontinuous precipitation (DP), each of ...
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Article
Development of a low-melting-point filler metal for brazing aluminum alloys
The study is concerned with develo** low-melting-point filler metals for brazing aluminum alloys. For this purpose, thermal analyses of a series of Al-Si-Cu-Sn filler metals have been conducted and correspon...
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Article
AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging
The interfacial reaction between liquid In-49Sn solders and Ag substrates results in the formation of a thicker Ag2In intermetallic compound accompanied with the development of a thin AgIn2 layer. Through further...
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Article
Brazeability of the 6061-T6 aluminum alloy with Al-Si-20Cu-based filler metals
The bond strength of the 6061-T6 aluminum alloy brazed with Al-12Si, Al-9.6Si-20Cu, and Al-7Si-20Cu-2Sn filer metals at a low temperature of 550°C is evaluated. The fractography of these brazements after tensi...
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Article
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
The corrosion behaviors of a series of Al-Si-Cu-based filler metals and the 6061-T6 butt joints brazed with these filler metals are evaluated by polarization tests and immersion tests in a 3.5% NaCl aqueous so...
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Article
Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals
Al-Si-Cu-based filler metals have been used successfully for brazing 6061 aluminum alloy as reported in the authors’ previous studies. For application in heat exchangers during manufacturing, the brazeability ...
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Article
Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate
For the soldering of recycled Ag sputtering targets, the interfacial reaction between liquid Sn and an Ag substrate at temperatures ranging from 250 –425°C has been investigated. Experimental results show that...
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Article
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
The interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films are investigated in the temperature range from 250–325 °C, and the morphology of intermetallic compounds formed after such solder...
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Article
Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages
The intermetallic compounds formed at the interfaces between In-49Sn solder balls and Au/Ni/Cu pads during the reflow of In-49Sn solder, ball-grid array (BGA) packages are investigated. Various temperature pro...
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Article
Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler
Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 °C in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investiga...
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Article
Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads
The reflow of Sn-58Bi solder joints in a BGA package with Au/Ni/Cu pads has been performed by employing various temperature profiles, which results in the formation of (Au0.66Ni0.34)(Sn0.82Bi0.18)4 intermetallic ...
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Article
Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
To improve the properties of the eutectic Sn3.5Ag0.5Cu lead-free solder, various amounts of mixed nano-Al2O3 particles were added. The microstructure, thermal analysis, density, thermal expansion coefficient (CTE...
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Article
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
The morphology and growth kinetics of intermetallic compounds (IMCs) formed during the soldering reactions between Sn3.5Ag0.5Cu and Ag substrates at various temperatures ranging from 250 to 350 °C were investi...
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Article
Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish
The effects of nano-TiO2 particles on the interfacial microstructures and bonding strength of Sn3.5Ag0.5Cu composite solder joints in ball grid array packages with immersion Sn surface finishes have been investig...
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Article
The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction
In this work, Sn3.0Ag0.7Cu (SAC) composite solders were produced by mechanically intermixing 0.5 wt% Al2O3 nanoparticles into Sn3.0Ag0.7Cu solder. The formation and growth kinetics of the intermetallic compounds ...
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Article
Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish
This study investigated the effects of TiO2 nanoparticles on the interfacial microstructures and bonding strength of Sn0.7Cu (SC) composite solder joints in ball grid array packages with immersion Sn surface fini...
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Chapter and Conference Paper
Water Tank Simulation of a Continuous Hot-Dip Galvanized Zinc Pot
This work has simulated the flow field in a hot-dip galvanized zinc pot using a water tank simulation. The flow pattern was visualized using laser sheet flow visualization technique. The general flow pattern i...
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Article
Microstructural characterization and mechanical properties of microplasma oxidized TiO2/Ti joints soldered using Sn3.5Ag4Ti(Ce) active filler
In this study, a micro-porous titania (TiO2) layer was synthesized on commercial pure Ti using the microplasma oxidation (MPO) method. Ti/Ti, MPO-TiO2 (MPO-Ti)/Ti and MPO-Ti/MPO-Ti were successfully active solder...
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Article
Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging
The interfacial evolution of nano-TiO2 reinforced low-Ag Sn0.3Ag0.7Cu composite solder on Cu substrate was investigated during 100 and 175 °C isothermal aging for up to 7 days. The thickness of interfacial inter...
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Article
Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders
The effects of TiO2 nanoparticles and cooling rate on the microstructure and mechanical properties of Sn1.5Sb0.7Cu alloy were investigated. A higher cooling rate and TiO2 nanoparticles refined the primary β-Sn de...
