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  1. No Access

    Article

    Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads

    The reflow of Sn-58Bi solder joints in a BGA package with Au/Ni/Cu pads has been performed by employing various temperature profiles, which results in the formation of (Au0.66Ni0.34)(Sn0.82Bi0.18)4 intermetallic ...

    C.C. Chi, L.C. Tsao, C.W. Tsao, T.H. Chuang in Journal of Materials Engineering and Perfo… (2008)

  2. No Access

    Article

    Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler

    Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 °C in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investiga...

    S. Y. Chang, L. C. Tsao, M. J. Chiang… in Journal of Materials Engineering and Perfo… (2003)

  3. No Access

    Article

    Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films

    The interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films are investigated in the temperature range from 250–325 °C, and the morphology of intermetallic compounds formed after such solder...

    T. L. Su, L. C. Tsao, S. Y. Chang… in Journal of Materials Engineering and Perfo… (2002)

  4. No Access

    Article

    Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals

    Al-Si-Cu-based filler metals have been used successfully for brazing 6061 aluminum alloy as reported in the authors’ previous studies. For application in heat exchangers during manufacturing, the brazeability ...

    L. C. Tsao, W. P. Weng, M. D. Cheng… in Journal of Materials Engineering and Perfo… (2002)

  5. No Access

    Article

    Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate

    For the soldering of recycled Ag sputtering targets, the interfacial reaction between liquid Sn and an Ag substrate at temperatures ranging from 250 –425°C has been investigated. Experimental results show that...

    T. L. Su, L. C. Tsao, S. Y. Chang… in Journal of Materials Engineering and Perfo… (2002)

  6. No Access

    Article

    Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements

    The corrosion behaviors of a series of Al-Si-Cu-based filler metals and the 6061-T6 butt joints brazed with these filler metals are evaluated by polarization tests and immersion tests in a 3.5% NaCl aqueous so...

    T. L. Su, S. S. Wang, L. C. Tsao… in Journal of Materials Engineering and Perfo… (2002)

  7. No Access

    Article

    Brazeability of the 6061-T6 aluminum alloy with Al-Si-20Cu-based filler metals

    The bond strength of the 6061-T6 aluminum alloy brazed with Al-12Si, Al-9.6Si-20Cu, and Al-7Si-20Cu-2Sn filer metals at a low temperature of 550°C is evaluated. The fractography of these brazements after tensi...

    L. C. Tsao, T. C. Tsai, C. S. Wu… in Journal of Materials Engineering and Perfo… (2001)

  8. No Access

    Article

    Effects of microstructures on corrosion and stress corrosion behaviors of an Al-12.1 at.% Zn alloy

    Various heat treatments of an Al-12.1 at.% Zn alloy would bring forth various types of microstructures such as solid solution (SS), continuous precipitation (CP), and discontinuous precipitation (DP), each of ...

    M. S. Yeh, L. C. Tsao, T. H. Chuang in Journal of Materials Engineering and Performance (2000)