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    Article

    Effect of Fabrication on High Cycle Fatigue Properties of Copper Thin Films

    The influence of fabrication on the tensile and fatigue behavior of copper films manufactured by 3 kinds of fabrication methods was investigated. The tensile and high cycle fatigue tests were performed using t...

    Jun-Hyub Park, Joong-Hyok An, Yun-Jae Kim, Hyeon-Chang Choi in Acta Mechanica Solida Sinica (2008)

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    Article

    FEM analysis of multilayered MEMS device under thermal and residual stress

    It is essential to ensure reliability to produce a Micro-Electro Mechanical Systems(MEMS) on commercial scale. Reliability problem in inkjet printhead, one of MEMS, is also very important. To eject an ink drop...

    Jun-Hyub Park, Hyeon-Chang Choi in Microsystem Technologies (2005)

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    Article

    Prediction of residual stress distribution in multi-stacked thin film by curvature measurement and iterative FEA

    In this study, residual stress distribution in multi-stacked film by MEMS (Micro-Electro Mechanical System) process is predicted using Finite Element method FEMi. We develop a finite element program for residu...

    Hyeon Chang Choi, Jun Hyub Park in Journal of Mechanical Science and Technology (2005)

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    Article

    Numerical analysis for prediction of fatigue crack opening level

    Finite element analysis (FEA) is the most popular numerical method to simulate plasticity-induced fatigue crack closure and can predict fatigue crack closure behavior. Finite element analysis under plane stres...

    Hyeon Chang Choi in KSME International Journal (2004)

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    Article

    A study on the determination of closing level for finite element analysis of fatigue crack closure

    An elastic-plastic finite element analysis is performed to investigate detailed closure behavior of fatigue cracks and the numerical results are compared with experimental results. The finite element analysis ...

    Hyeon Chang Choi in KSME International Journal (2000)