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Article
Effect of Fabrication on High Cycle Fatigue Properties of Copper Thin Films
The influence of fabrication on the tensile and fatigue behavior of copper films manufactured by 3 kinds of fabrication methods was investigated. The tensile and high cycle fatigue tests were performed using t...
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Article
FEM analysis of multilayered MEMS device under thermal and residual stress
It is essential to ensure reliability to produce a Micro-Electro Mechanical Systems(MEMS) on commercial scale. Reliability problem in inkjet printhead, one of MEMS, is also very important. To eject an ink drop...
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Article
Prediction of residual stress distribution in multi-stacked thin film by curvature measurement and iterative FEA
In this study, residual stress distribution in multi-stacked film by MEMS (Micro-Electro Mechanical System) process is predicted using Finite Element method FEMi. We develop a finite element program for residu...
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Article
Numerical analysis for prediction of fatigue crack opening level
Finite element analysis (FEA) is the most popular numerical method to simulate plasticity-induced fatigue crack closure and can predict fatigue crack closure behavior. Finite element analysis under plane stres...
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Article
A study on the determination of closing level for finite element analysis of fatigue crack closure
An elastic-plastic finite element analysis is performed to investigate detailed closure behavior of fatigue cracks and the numerical results are compared with experimental results. The finite element analysis ...