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Article
Equi-Axed Grain Formation in Electrodeposited Sn-Bi
Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity, and corrosion resistance. However, Sn whiskers have been observed to ...
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Article
Observed correlation of Sn oxide film to Sn whisker growth in Sn-Cu electrodeposit for Pb-free solders
Localized cracking of surface oxide has been proposed as a necessary step in the nucleation of Sn whiskers in Sn electrodeposited films. To evaluate the effects of the oxide film on Sn whisker growth, a bright...
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Article
Thermal transport through thin films: Mirage technique measurements on aluminum/titanium multilayers
Thermal transport properties of multilayer thin films both normal and parallel to the layers were measured. Al/Ti multilayer films 3 μm thick, with individual layers systematically varied from 2.5 to 40 nm, we...
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Article
The microstructure of electrodeposited titanium-aluminum alloys
The microstructure of electrodeposited titanium-aluminide alloys containing 3.6 to 24.1 at. pct Ti was studied by transmission electron microscopy. The surface morphology of the deposits showed that they conta...