Skip to main content

2 Result(s)

within Cunji Pu Remove this filter

and

  1. No Access

    Article

    Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn–Zn lead-free solder alloy by high-throughput method

    Sn–Zn lead-free solder alloy is seriously restricted in the applications of electronic equipment and circuit boards due to the poor wettability and corrosion resistance. The alloying method is considered as th...

    Fang Li, Cunji Pu, Caiju Li, Jiaojiao Yang… in Journal of Materials Science: Materials in… (2023)

  2. No Access

    Article

    Effects of Bi Addition on the Solderability and Mechanical Properties of Sn-Zn-Cu Lead-Free Solder

    In the present work, the effects of Bi addition on the microstructure, solderability, and mechanical properties of Sn-Zn-Cu lead-free solder were studied. The composition of Sn-Zn-Cu-Bi solder was designed by ...

    Cunji Pu, Jialong Qiu, Caiju Li, Peng Gao, Yanzhi Peng… in Journal of Electronic Materials (2022)