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  1. No Access

    Article

    Mechanical Behavior of Sn-3.0Ag-0.5Cu/Cu Solder Joints After Isothermal Aging

    The tensile impact behavior of lead-free Sn-3Ag-0.5Cu/Cu solder joints aged at 413 K and 453 K for times ranging from 24 h to 1000 h has been investigated in this study. The activation energy for growth of the...

    Van Luong Nguyen, Chin-Sung Chung, Ho-Kyung Kim in Journal of Electronic Materials (2016)

  2. No Access

    Article

    Fatigue properties of fine grained magnesium alloys after severe plastic deformation

    Fine grained AZ31 and AZ61 magnesium alloys produced by equal channel angular pressing (ECAP) were tested for investigating tensile and fatigue properties, including microstructure, monotonic tensile flow, fat...

    Chin-Sung Chung, Duk-Kyu Chun, HoKyung Kim in Journal of Mechanical Science and Technology (2005)

  3. No Access

    Article

    Fatigue crack growth behavior in ultrafine grained low carbon steel

    Ultrafine grained (UFG) low carbon (0.15 wt.% C) steel produced by equal channel angular pressing (ECAP) was tested for investigating the effect of load ratio on the fatigue crack growth rate. Fatigue crack gr...

    Ho-Kyung Kim, Myung-Il Choi, Chin-Sung Chung, Dong-Hyuk Shin in KSME International Journal (2002)

  4. No Access

    Article

    Steady-state creep behavior of a Ti-25al-10Nb-3v-lMo alloy

    Creep tests were conducted on Ti-25Al-10Nb-3V-1Mo alloy in the the temperature range of 913 - 1093 K at stresses ranging from 40 to 600 MPa. The creep behavior of the Ti3Al alloy under these testing conditions re...

    Ho-Kyung Kim, Chang-Yong Hyun, Chin-Sung Chung in Metals and Materials (1999)