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    Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

    Wire bonding is key to high-quality IC assembly in semiconductor packaging. An electrical test was conducted before wire bonding. During the electrical test, the needle probes touched the surface of each bond ...

    **g-Er Chiu, Chau-Shing Wang, Shih-Wen Lu in The International Journal of Advanced Manu… (2022)