Page
%P
![Loading...](https://link.springer.com/static/c4a417b97a76cc2980e3c25e2271af3129e08bbe/images/pdf-preview/spacer.gif)
-
Article
New soldering processes and solder systems for hybrid microsystems: developments and applications
One of the promising joining technologies for the assembly of hybrid microsystems is soldering. This technique meets the specific requirements of the microstructures, like a high flexibility concerning materia...
-
Chapter
Transient Liquid Phase Bonding