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    Article

    New soldering processes and solder systems for hybrid microsystems: developments and applications

    One of the promising joining technologies for the assembly of hybrid microsystems is soldering. This technique meets the specific requirements of the microstructures, like a high flexibility concerning materia...

    K. Bobzin, E. Lugscheider, H. Zhuang, F. Ernst, N. Bagcivan in Microsystem Technologies (2006)

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    Chapter

    Transient Liquid Phase Bonding

    K. Bobzin, L. Bosse, A. Brandenburg, U. Dilthey, A. Erdle in Montage hybrider Mikrosysteme (2005)