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Chapter
Research and Development History of Three-Dimensional Integration Technology
The first chapter of the book introduces research and development history of three-dimensional (3D) integration technology. Concept of through-Si via (TSV) is old but the industrialization of 3D integration te...
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Chapter
Dream Chip Project at ASET
Chapter 9 introduces the results of Japanese national research and development (R&D) initiative of 3D integration technology using through-silicon via (TSV) over the 5-year period from 2008 to 2012. Associatio...
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Chapter
Recent Research and Development Activities of Three-Dimensional Integration Technology
The second chapter describes the recent research and development history of three-dimensional (3D) integration technology. In this chapter we can see so many development activities in the word from 2013. It to...