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    Article

    In Situ Characterization of Triboelectrochemical Effects on Topography of Patterned Copper Surfaces

    The topographic response of patterned copper surfaces to chemical–mechanical polishing (CMP) was investigated using a triboelectrochemical approach. Experimental methods include using a combined system contain...

    Sukbae Joo, Hong Liang in Journal of Electronic Materials (2013)

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    Article

    Local/global planarization of polysilicon micropatterns by selectivity controlled CMP

    The planarization CMP, which is considered as one of the most important ULSI chip, is introduced to make flat surface in patterned areas for multilevel MEMS devices. However, the conventional CMP is limited in...

    Woonki Shin, Sungmin Park, Hyoungjae Kim… in International Journal of Precision Enginee… (2009)