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  1. No Access

    Article

    The Mbe Growth of Widegap II-VI Injection Lasers and LEDs

    Striking progress in the development of II-VI semiconductor heterostructures, coupled with seminal advances in do**, has very recently led to the first demonstration of blue and blue/green diode lasers opera...

    W. **e, D. C. Grillo, M. Kobayashi, R. L. Gunshor in MRS Online Proceedings Library (1992)

  2. No Access

    Article

    Investigation of Optimal Photosensor in A-SI:H Liquid Crystal Light Valves

    The a-Si:H thin film is used for a photosensor in liquid crystal light valve(LCLV). A lumped element model for the layered a-Si:H LCLV is developed. It has been shown that the dark and photo-resistances of the...

    Piyi Du, Gaorong Han, Jianmin Qiao, Weiqiang Han in MRS Online Proceedings Library (1992)

  3. No Access

    Article

    Ion Implantation to Inhibit Corrosion of Copper

    Ion implantation of boron and aluminium is used to passivate copper surfaces. Such a process modifies the copper only near its surface without affecting copper's desirable bulk properties. The present experime...

    P. J. Ding, W. A. Lanford, S. Hymes, S. P. Murarka in MRS Online Proceedings Library (1992)

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    Article

    Interactions and Stability of Cu on CoSi2

    Copper is being investigated for application as multi-level interconnection metal in silicon ultra-large-scale integration (ULSI). On the other hand, COSi2 is being tested for application as contacts in sub-half ...

    Y. -T. Shy, S. P. Murarka, A. R. Sitaram, P. -J. Ding in MRS Online Proceedings Library (1992)

  5. No Access

    Article

    The growth of single-crystal fibres directly from source rods made of ultrafine powders

    By means of the laser-heated pedestal growth (LHPG) method, the growth of single-crystal fibres directly from source rods made of ultrafine powders is studied in this paper. The ultrafine powders were obtained...

    Senlin Fu, Jusheng Jiang, Jiqin Chen, Zuchang Ding in Journal of Materials Science (1993)

  6. No Access

    Article

    Surface-enhanced Raman scattering and cyclic voltammetry studies of synergetic effects in the corrosion inhibition of copper by polybenzimidazole and mercaptobenzimidazole at high temperature

    The inhibition of copper corrosion by polybenzimidazole and mercaptobenzimidazole at room and high temperature was assessed by in situ surface-enhanced Raman scattering (SERS) and cyclic voltammetry (CV). It was ...

    K. T. Carron, M. L. Lewis, Jian Dong, Jianfu Ding, Gi Xue in Journal of Materials Science (1993)

  7. No Access

    Article

    Structural Nature of Nanocrystalline Silicon

    Nanocrystalline silicon (nc-Si:H) films with an average grain size ranging between 2 and 10 nm are prepared in a modified plasma chemical vapor deposition system. X-ray diffraction, transmission electron diffr...

    Weiqiang Han, Gaorong Han, Jianmin Qiao, Piyi Du in MRS Online Proceedings Library (1993)

  8. No Access

    Article

    Heteroepitaxial Growth of Cubic GaN on GaAs(100) by Reactive Nitrogen Source

    Zinc-blende GaN has been successfully grown on GaAs(100) by using low-energy nitrogen ions produced by a conventional ion gun to replace the ECR plasma source in the traditional MBE facility for nitride growth...

    Z.Q. He, X.M. Ding, X.Y. Hou, Xun Wang in MRS Online Proceedings Library (1993)

  9. No Access

    Article

    Reconstruction of the 3-D Atomic Structure of CoSi2(111) by Photoelectron Holography

    We report the use of photoelectron holography for the study of the atomic geometry of the (111) surface of single crystal CoSi2. We employ as a reference wave the Co 3p core electron emitted with a kinetic energy...

    Y. Zhou, X. Chen, J.C. Campuzano, G. Jennings, K. Gofron in MRS Online Proceedings Library (1993)

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    Article

    Observation of Reduced Oxidation Rates for Plasma-Assisted CVD Copper Films

    Oxidation kinetics of plasma-assisted chemical vapor deposited (PA-CVD) copper films were investigated using Rutherford backscattering spectrometry (RBS). The PA-CVD copper films were deposited using hydrogen ...

    P. J. Ding, B. Zheng, E. T. Eisenbraun, W. A. Lanford in MRS Online Proceedings Library (1993)

  11. No Access

    Article

    Interlaminar fracture of carbon-thermoplastic polyimide composites

    Mode I interlaminar fracture of a novel amorphous thermoplastic polyimide reinforced with unidirectional carbon fibre has been studied experimentally using double cantilever beam specimens and scanning electro...

    Jiang Zhou, Tianbai He, ** Zhang, Mengxian Ding in Journal of Materials Science (1994)

  12. No Access

    Article

    The In-Based Metal Ohmic Contacts to n-GaAs

    Electrical, structural and reaction characteristics of In-based ohmic contacts to n-GaAs was studied. Attempts were made to form a low band gap interfacial phase of InGaAs to reduce the barrier height at the m...

    Sun-An Ding, Tiwen Fan, Zhenjia Xu, C. C. Hsu in MRS Online Proceedings Library (1994)

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    Article

    The Stability of TiH2 Used as Diffusion Barrier on SiO2 Substrates

    TiH2 has been considered as a diffusion barrier and adhesion promoter between oxide and Cu. This phase is formed by reaction of Ti with hydrogen during rapid thermal annealings. In this investigation the stabilit...

    Shyam P. Murarka, Sen-Hou Ko, Pei-Jun Ding in MRS Online Proceedings Library (1994)

  14. No Access

    Article

    The Surface Damage in SiO2 Caused by Chemical Mechanical Polishing on Ic-60 Pads

    Chemical Mechanical polishing (CMP) is a useful technique for achieving global planarization in the ICs. The CMP of oxide has been used and studied for decades. Only recently the technique has been employed fo...

    Shyam Murarka, Sen-Hou Ko, Minoru Tomozawa, Pei-Jun Ding in MRS Online Proceedings Library (1994)

  15. No Access

    Article

    Surface and Interface Modification of Copper for Electronic Application

    Before copper will be used in the manufacture of microelectronic circuits, a number of its surface and interface properties have to be addressed. These include corrosion resistance, adhesion to dielectrics, an...

    W. A. Lanford, P. J. Ding, S. Hymes, S. P. Murarka in MRS Online Proceedings Library (1994)

  16. No Access

    Article

    Growth Kinetics and Materials Properties of Cu5Si

    Thin copper films have been passivated by exposure to a dilute silane mixture (2% SiH4/Ar) at temperatures in the range of 225 - 375 °C. Previous XRD characterization indicates the surface layer to be Cu5Si[l]. S...

    S. Hymes, S. P. Murarka, P. J. Ding, W. Wang in MRS Online Proceedings Library (1994)

  17. No Access

    Article

    Irradiation Mixing of Al into U3Si

    Thermal and irradiation induced intermixing of uranium suicide reactor fuels with the aluminum cladding is an important consideration in understanding their fission gas and fuel swelling behavior. We have used...

    R. C. Birtcher, F.-R. Ding, B. J. Kestel, P. M. Baldo in MRS Online Proceedings Library (1995)

  18. No Access

    Article

    Effects of Light on the Resonant Tunneling in Silicon Quantum Dot Diode

    The resonant tunneling via nanoscale silicon particles embedded in an a-SiO2 matrix in a diode structure has revealed a range of intriguing observations such as extremely sharp peaks and steps and periodic oscill...

    Chen Ding, Raphael Tsu in MRS Online Proceedings Library (1995)

  19. No Access

    Article

    Ageing behaviour of t′-phase in a hot-pressed ZrO2(4 mol% Y2O3) ceramic

    The ageing behaviour of unequilibrium tetragonal (t′) phase and its resultant effect on the mechanical properties of hot-pressed ZrO2(4 mol% Y2O3) ceramic have been investigated by means of transmission electron ...

    W. Z. Zhu, T. C. Lei, Y. Zhou, Z. S. Ding in Journal of Materials Science (1995)

  20. No Access

    Article

    Electrochemical Characterization of Orthorhombic NaXMnO2 for Alkali Metal Polymer Batteries

    Marca M. Doeff, Lei Ding, L. C. De Jonghe in MRS Online Proceedings Library (1995)

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