Abstract
Present day ion implanters provide uniform distribution of energetic ions into target materials, utilizing one or two of the basic beam scanning techniques; electrostatic, magnetic, and mechanical. Each beam scanning technique has physical limits and characteristics which affect its successful use in an ion implanter for semiconductor processing. This paper reviews the features and limits of each beam scanning technique. X-Y beam scanning systems using magnetic and electrostatic deflection are described. The ability for electrostatic X-Y scanning of μ perv.*, is reviewed and results reported.
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© 1983 Springer-Verlag Berlin Heidelberg
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Turner, N. (1983). Comparison of Beam Scanning Systems. In: Ryssel, H., Glawischnig, H. (eds) Ion Implantation: Equipment and Techniques. Springer Series in Electrophysics, vol 11. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-69156-0_15
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DOI: https://doi.org/10.1007/978-3-642-69156-0_15
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-69158-4
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